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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSS-B20-085H HEATSINK TO-220 3.4W ALUMINUM CUI Devices	2,446	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	PC Pin	Rectangular, Fins	0.303 (7.70mm)	0.775 (19.68mm)	-	0.790 (20.00mm)	3.4W @ 75°C	7.46°C/W @ 200 LFM	22.06°C/W	Aluminum
HSS-B20-097H HEATSINK TO-220 3.6W ALUMINUM CUI Devices	3,368	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.394 (10.00mm)	0.830 (21.08mm)	-	0.748 (19.00mm)	3.6W @ 75°C	5.39°C/W @ 200 LFM	20.59°C/W	Aluminum
HSS-B20-0953H HEATSINK TO-220 4W ALUMINUM CUI Devices	2,633	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level	PC Pin	Rectangular, Fins	1.500 (38.10mm)	0.504 (12.80mm)	-	0.500 (12.70mm)	4.0W @ 75°C	5.01°C/W @ 200 LFM	18.63°C/W	Aluminum
HSB04-171706 HEAT SINK, BGA, 17 X 17 X 6 MM CUI Devices	3,060	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.669 (17.00mm)	0.669 (17.00mm)	-	0.236 (6.00mm)	2.5W @ 75°C	13.10°C/W @ 200 LFM	29.73°C/W	Aluminum Alloy
HSE-B20250-040H HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	3,402	-	RFQ	Ficha técnica	Tray	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	0.984 (25.00mm)	1.378 (35.00mm)	-	0.492 (12.50mm)	5.0W @ 75°C	4.28°C/W @ 200 LFM	15.00°C/W	Aluminum Alloy
HSB07-202009 HEAT SINK, BGA, 20 X 20 X 9 MM CUI Devices	2,952	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.787 (20.00mm)	0.787 (20.00mm)	-	0.354 (9.00mm)	3.1W @ 75°C	8.60°C/W @ 200 LFM	24.08°C/W	Aluminum Alloy
HSS-C52-NP-SMT-TR HEAT SINK TO-252 COPPER CUI Devices	3,499	-	RFQ	Ficha técnica	Tape & Reel (TR)	HSS	Active	Top Mount	-	Rectangular, Fins	0.315 (8.00mm)	0.900 (22.86mm)	-	0.400 (10.16mm)	2.1W @ 75°C	10.05°C/W @ 200 LFM	35.71°C/W	Copper
HSE-B20254-035H-02 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	3,625	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	5.5W @ 75°C	4.39°C/W @ 200 LFM	13.64°C/W	Aluminum Alloy
HSE-B20270-040H HEAT SINK, EXTRUSION, TO-220, 27 CUI Devices	3,734	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.063 (27.00mm)	1.378 (35.00mm)	-	0.492 (12.50mm)	6.0W @ 75°C	3.64°C/W @ 200 LFM	12.50°C/W	Aluminum Alloy
HSE-B20381-035H-02 HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices	2,433	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.500 (38.10mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	6.9W @ 75°C	3.32°C/W @ 200 LFM	10.87°C/W	Aluminum Alloy
HSS25-B20-P51 HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	3,706	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level	PC Pin	Square, Fins	1.000 (25.40mm)	1.000 (25.40mm)	-	1.673 (42.50mm)	5.88W @ 75°C	6.30°C/W @ 200 LFM	12.75°C/W	Aluminum Alloy
HSE-B20381-035H-01 HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices	3,228	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.500 (38.10mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	7.0W @ 75°C	2.67°C/W @ 200 LFM	10.71°C/W	Aluminum Alloy
HSS12-B20-P95 HEAT SINK, STAMPING, TO-220, 19 CUI Devices	3,022	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	PC Pin	Rectangular	0.866 (22.00mm)	0.748 (19.00mm)	-	0.433 (11.00mm)	2.7W @ 75°C	10.90°C/W @ 200 LFM	27.37°C/W	Aluminum Alloy
HSE-B381-04H HEAT SINK, EXTRUSION, TO-220/TO- CUI Devices	2,088	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.500 (38.10mm)	0.650 (16.50mm)	-	0.630 (16.00mm)	5.9W @ 75°C	4.44°C/W @ 200 LFM	12.71°C/W	Aluminum Alloy
HSS-B20-0508H-01 HEATSINK TO-220 7.4W ALUMINUM CUI Devices	3,442	-	RFQ	Ficha técnica	Tray	HSS	Active	Board Level	PC Pin	Rectangular, Fins	1.000 (25.40mm)	1.000 (25.40mm)	-	1.673 (42.50mm)	7.4W @ 75°C	3.51°C/W @ 200 LFM	10.14°C/W	Aluminum
HSE-B20500-040H-01 HEAT SINK, EXTRUSION, TO-220, 50 CUI Devices	3,508	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	PC Pin	Rectangular, Angled Fins	1.969 (50.00mm)	1.359 (34.50mm)	-	0.492 (12.50mm)	8.9W @ 75°C	8.90°C/W @ 200 LFM	8.43°C/W	Aluminum Alloy
HSE-B20508-035H HEAT SINK, EXTRUSION, TO-220, 50 CUI Devices	3,112	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.000 (50.80mm)	1.375 (34.93mm)	-	0.500 (12.70mm)	7.8W @ 75°C	5.17°C/W @ 200 LFM	9.62°C/W	Aluminum Alloy
HSE-B20508-035H-01 HEAT SINK, EXTRUSION, TO-220, 50 CUI Devices	2,262	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.000 (50.80mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	8.2W @ 75°C	4.76°C/W @ 200 LFM	9.15°C/W	Aluminum Alloy
HSE-B381-045H HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices	3,032	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.500 (38.10mm)	1.772 (45.00mm)	-	0.500 (12.70mm)	9.9W @ 75°C	2.63°C/W @ 200 LFM	7.58°C/W	Aluminum Alloy
HSS-B20-05H HEATSINK TO-220 9.8W ALUMINUM CUI Devices	2,715	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	0.728 (18.50mm)	2.007 (50.98mm)	-	1.614 (41.00mm)	9.8W @ 75°C	2.01°C/W @ 200 LFM	7.65°C/W	Aluminum