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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSE10-B20-NP HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	3,000	-	RFQ	Ficha técnica	Bag	HSE	Active	Top Mount	Bolt On	Rectangular	0.984 (25.00mm)	0.472 (12.00mm)	-	0.177 (4.50mm)	1.95W @ 75°C	20.90°C/W @ 200 LFM	38.45°C/W	Aluminum Alloy
HSE12-B20-NP HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	2,000	-	RFQ	Ficha técnica	Bag	HSE	Active	Top Mount	Bolt On	Rectangular	0.984 (25.00mm)	0.472 (12.00mm)	-	0.177 (4.50mm)	1.94W @ 75°C	19.20°C/W @ 200 LFM	38.75°C/W	Aluminum Alloy
HSS19-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	2,988	-	RFQ	Ficha técnica	Bag	HSS	Active	Top Mount	Bolt On	Rectangular, Fins	0.866 (22.00mm)	0.748 (19.00mm)	-	0.748 (19.00mm)	3.35W @ 75°C	8.80°C/W @ 200 LFM	22.39°C/W	Aluminum Alloy
HSS20-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	2,390	-	RFQ	Ficha técnica	Bag	HSS	Active	Top Mount	Bolt On	Rectangular, Fins	0.866 (22.00mm)	0.748 (19.00mm)	-	0.433 (11.00mm)	2.84W @ 75°C	11.20°C/W @ 200 LFM	26.40°C/W	Aluminum Alloy
HSS23-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	2,662	-	RFQ	Ficha técnica	Box	HSS	Active	Top Mount	Bolt On	Rectangular, Fins	1.654 (42.00mm)	1.496 (38.00mm)	-	0.787 (20.00mm)	7.36W @ 75°C	5.00°C/W @ 200 LFM	10.19°C/W	Aluminum Alloy
HSS05-C20-SMT-TR HEAT SINK, STAMPING, TO-220, 12. CUI Devices	1,957	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	HSS	Active	Board Level, Vertical	-	Rectangular	1.031 (26.20mm)	0.500 (12.70mm)	-	0.390 (9.91mm)	2.3W @ 75°C	14.00°C/W @ 200 LFM	32.69°C/W	Copper Alloy
HSB24-252510 HEAT SINK, BGA,25 X 25 X 10 MM CUI Devices	1,360	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.984 (25.00mm)	0.984 (25.00mm)	-	0.394 (10.00mm)	4.14W @ 75°C	6.50°C/W @ 200 LFM	18.10°C/W	Aluminum Alloy
HSS26-B20-P38 HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	3,000	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	2.000 (50.80mm)	1.378 (35.00mm)	-	0.335 (8.50mm)	4.5W @ 75°C	9.20°C/W @ 200 LFM	16.66°C/W	Aluminum Alloy
HSB10-232306 HEAT SINK, BGA, 23 X 23 X 6 MM CUI Devices	1,503	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.906 (23.00mm)	0.906 (23.00mm)	-	0.236 (6.00mm)	3.0W @ 75°C	9.60°C/W @ 200 LFM	25.46°C/W	Aluminum Alloy
HSE04-251265-2 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	2,777	-	RFQ	Ficha técnica	Bag	HSE	Active	Top Mount	Bolt On	Rectangular, Fins	0.984 (25.00mm)	0.472 (12.00mm)	-	0.256 (6.50mm)	2.47W @ 75°C	16.60°C/W @ 200 LFM	30.38°C/W	Aluminum Alloy
HSE04-251265-1 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	2,793	-	RFQ	Ficha técnica	Bag	HSE	Active	Top Mount	Bolt On	Rectangular, Fins	0.984 (25.00mm)	0.472 (12.00mm)	-	0.256 (6.50mm)	2.4W @ 75°C	16.30°C/W @ 200 LFM	31.22°C/W	Aluminum Alloy
HSS09-B20-P431 HEAT SINK, STAMPING, TO-220, 29. CUI Devices	2,874	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.180 (29.97mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	4.0W @ 75°C	7.70°C/W @ 200 LFM	18.82°C/W	Aluminum Alloy
HSS27-B20-P43 HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	2,500	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.193 (30.30mm)	0.874 (22.20mm)	-	0.211 (5.35mm)	3.03W @ 75°C	13.20°C/W @ 200 LFM	24.79°C/W	Aluminum Alloy
HSS24-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	2,992	-	RFQ	Ficha técnica	Box	HSS	Active	Top Mount	Bolt On	Rectangular, Fins	1.654 (42.00mm)	1.496 (38.00mm)	-	0.984 (25.00mm)	7.85W @ 75°C	4.30°C/W @ 200 LFM	9.56°C/W	Aluminum Alloy
HSS11-B20-P38 HEAT SINK, STAMPING, TO-220, 50. CUI Devices	2,215	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	2.000 (50.80mm)	1.260 (32.00mm)	-	0.500 (12.70mm)	4.8W @ 75°C	6.90°C/W @ 200 LFM	15.76°C/W	Aluminum Alloy
HSS15-B20-P40 HEAT SINK, STAMPING, TO-220, 23. CUI Devices	4,828	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.500 (38.10mm)	0.921 (23.40mm)	-	0.500 (12.70mm)	5.0W @ 75°C	8.50°C/W @ 200 LFM	15.16°C/W	Aluminum Alloy
HSB26-343408 HEAT SINK, BGA, 33.5 X 33.5 X 8 CUI Devices	1,219	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.319 (33.50mm)	1.319 (33.50mm)	-	0.315 (8.00mm)	4.94W @ 75°C	5.30°C/W @ 200 LFM	15.19°C/W	Aluminum Alloy
HSS02-B20-P318 HEAT SINK, STAMPING, TO-220, 23. CUI Devices	1,628	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.900 (48.26mm)	0.930 (23.62mm)	-	0.950 (24.13mm)	6.9W @ 75°C	4.80°C/W @ 200 LFM	10.90°C/W	Aluminum Alloy
HSS04-B20-P318 HEAT SINK, STAMPING, TO-220, 41. CUI Devices	1,984	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular	1.650 (41.91mm)	1.750 (44.45mm)	-	0.380 (9.65mm)	5.9W @ 75°C	5.50°C/W @ 200 LFM	12.79°C/W	Aluminum Alloy
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 CUI Devices	1,708	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Push Pin	Square, Pin Fins	1.122 (28.50mm)	1.122 (28.50mm)	-	0.394 (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy