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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 CUI Devices	2,957	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.969 (50.00mm)	1.181 (30.00mm)	-	0.472 (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy
HSB21-454515 HEAT SINK, BGA, 45 X 45 X 15 MM CUI Devices	3,430	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.772 (45.00mm)	1.772 (45.00mm)	-	0.591 (15.00mm)	9.9W @ 75°C	2.80°C/W @ 200 LFM	7.56°C/W	Aluminum Alloy
HSS-B20-0635H HEATSINK TO-220 2.6W ALUMINUM CUI Devices	3,046	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.520 (13.20mm)	0.250 (6.35mm)	-	0.748 (19.00mm)	2.6W @ 75°C	10.68°C/W @ 200 LFM	28.85°C/W	Aluminum
HSS-B20-NP-04 HEATSINK TO-220 6.5W ALUMINUM CUI Devices	3,398	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level	Bolt On	Rectangular, Fins	1.450 (36.83mm)	1.750 (44.45mm)	-	0.370 (9.40mm)	6.5W @ 75°C	3.76°C/W @ 200 LFM	11.54°C/W	Aluminum
HSS-B20-NP-06 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	2,249	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On	Square, Fins	0.748 (19.00mm)	0.748 (19.00mm)	-	0.375 (9.52mm)	2.9W @ 75°C	7.51°C/W @ 200 LFM	26.32°C/W	Aluminum
HSS-B20-061H-03 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	3,707	-	RFQ	Ficha técnica	Bulk,Bag	HSS	Active	Board Level	PC Pin	Rectangular, Fins	0.512 (13.00mm)	0.512 (13.00mm)	-	0.748 (19.00mm)	2.9W @ 75°C	5.72°C/W @ 200 LFM	25.86°C/W	Aluminum
HSS-B20-0508H-01R HEATSINK TO-220 4.7W ALUMINUM CUI Devices	959	-	RFQ	Ficha técnica	Bulk,Bag	HSS	Active	Board Level	Bolt On and Board Mounts	Rectangular, Fins	0.500 (12.70mm)	1.000 (25.40mm)	-	1.180 (29.97mm)	4.7W @ 75°C	5.87°C/W @ 200 LFM	15.83°C/W	Aluminum
HSS-B20-0953H-01 HEATSINK TO-220 2.3W ALUMINUM CUI Devices	984	-	RFQ	Ficha técnica	Bulk,Bag	HSS	Active	Board Level	PC Pin	Rectangular, Fins	0.500 (12.70mm)	0.504 (12.80mm)	-	0.590 (15.00mm)	2.3W @ 75°C	11.04°C/W @ 200 LFM	33.28°C/W	Aluminum
HSS-B20-065V HEATSINK TO-220 4W ALUMINUM CUI Devices	3,040	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	PC Pin	Rectangular, Fins	0.500 (12.70mm)	0.504 (12.80mm)	-	1.500 (38.10mm)	4.0W @ 75°C	5.01°C/W @ 200 LFM	18.63°C/W	Aluminum
HSS14-B20-NP HEAT SINK, STAMPING, TO-220, 19. CUI Devices	3,727	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	-	Rectangular	0.980 (24.89mm)	0.750 (19.05mm)	-	0.157 (4.00mm)	3.1W @ 75°C	11.60°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy
HSS-B20-053H-01 HEATSINK TO-220 4.8W ALUMINUM CUI Devices	3,492	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On and PC Pin	Rectangular, Fins	0.500 (12.70mm)	1.000 (25.40mm)	-	1.181 (30.00mm)	4.8W @ 75°C	5.83°C/W @ 200 LFM	15.79°C/W	Aluminum
HSS-B20-0503H HEATSINK TO-220 4.6W ALUMINUM CUI Devices	3,514	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.500 (12.70mm)	1.000 (25.40mm)	-	1.180 (29.97mm)	4.6W @ 75°C	5.44°C/W @ 200 LFM	16.30°C/W	Aluminum
HSE-B20350-NP HEAT SINK, EXTRUSION, TO-220, 35 CUI Devices	2,389	-	RFQ	Ficha técnica	Tray	HSE	Active	Board Level	Bolt On	Rectangular, Fins	1.378 (35.00mm)	1.142 (29.00mm)	-	0.472 (12.00mm)	6.2W @ 75°C	2.91°C/W @ 200 LFM	12.10°C/W	Aluminum Alloy
HSE-B254-04H HEAT SINK, EXTRUSION, TO-220/TO- CUI Devices	3,405	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	0.650 (16.50mm)	-	0.630 (16.00mm)	4.7W @ 75°C	4.93°C/W @ 200 LFM	15.96°C/W	Aluminum Alloy
HSE-B20380-040H HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices	3,856	-	RFQ	Ficha técnica	Tray	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.496 (38.00mm)	1.378 (35.00mm)	-	0.492 (12.50mm)	7.4W @ 75°C	3.94°C/W @ 200 LFM	10.14°C/W	Aluminum Alloy
HSE-B20254-035H-01 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	3,064	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	5.2W @ 75°C	4.42°C/W @ 200 LFM	14.42°C/W	Aluminum Alloy
HSE-B20381-035H HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices	3,579	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.500 (38.10mm)	1.375 (34.93mm)	-	0.500 (12.70mm)	6.5W @ 75°C	3.66°C/W @ 200 LFM	11.54°C/W	Aluminum Alloy
HSE-B20380-040H-01 HEAT SINK, EXTRUSION, TO-220, 38 CUI Devices	2,633	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	PC Pin	Rectangular, Angled Fins	1.496 (38.00mm)	1.359 (34.50mm)	-	0.492 (12.50mm)	7.3W @ 75°C	5.77°C/W @ 200 LFM	10.27°C/W	Aluminum Alloy
HSE-B20254-040H HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	2,238	-	RFQ	Ficha técnica	Bag	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.000 (25.40mm)	1.260 (32.00mm)	-	0.551 (14.00mm)	5.7W @ 75°C	7.74°C/W @ 200 LFM	13.16°C/W	Aluminum Alloy
HSE-B20500-040H HEAT SINK, EXTRUSION, TO-220, 50 CUI Devices	3,907	-	RFQ	Ficha técnica	Tray	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.969 (50.00mm)	1.378 (35.00mm)	-	0.492 (12.50mm)	8.9W @ 75°C	4.85°C/W @ 200 LFM	8.43°C/W	Aluminum Alloy