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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSE-B18381-0396H HEAT SINK, EXTRUSION, TO-218, 38 CUI Devices	3,622	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.500 (38.10mm)	1.654 (42.00mm)	-	0.984 (25.00mm)	10.8W @ 75°C	2.29°C/W @ 200 LFM	6.94°C/W	Aluminum Alloy
HSE-B18254-060H-W HEAT SINK, EXTRUSION, TO-218, 25 CUI Devices	2,100	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.638 (41.60mm)	-	0.984 (25.00mm)	8.1W @ 75°C	3.09°C/W @ 200 LFM	9.26°C/W	Aluminum Alloy
HSE-B18635-035H HEAT SINK, EXTRUSION,TO-218, 63. CUI Devices	2,370	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.500 (63.50mm)	1.638 (41.60mm)	-	0.984 (25.00mm)	16.7W @ 75°C	2.24°C/W @ 200 LFM	4.49°C/W	Aluminum Alloy
HSE-B635-045H HEAT SINK, EXTRUSION, TO-220, 63 CUI Devices	3,996	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.500 (63.50mm)	1.772 (45.00mm)	-	0.500 (12.70mm)	11.7W @ 75°C	3.53°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy
HSE-B18635-060H-W HEAT SINK, EXTRUSION, TO-218, 63 CUI Devices	2,844	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.500 (63.50mm)	1.638 (41.60mm)	-	0.984 (25.00mm)	16.7W @ 75°C	2.24°C/W @ 200 LFM	4.49°C/W	Aluminum Alloy
HSE-B18508-060H-W HEAT SINK, EXTRUSION,TO-218, 50. CUI Devices	3,337	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.000 (50.80mm)	1.638 (41.60mm)	-	0.984 (25.00mm)	12.8W @ 75°C	2.98°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy
HSE-B18318-0396H HEAT SINK, EXTRUSION,TO-218, 31. CUI Devices	2,477	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.250 (31.75mm)	1.654 (42.00mm)	-	0.984 (25.00mm)	9.1W @ 75°C	2.57°C/W @ 200 LFM	8.24°C/W	Aluminum Alloy
HSE-B18508-0396H HEAT SINK, EXTRUSION, TO-218, 50 CUI Devices	3,435	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.000 (50.80mm)	1.654 (42.00mm)	-	0.984 (25.00mm)	12.8W @ 75°C	2.45°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy
HSE-B18635-0396H HEAT SINK, EXTRUSION, TO-218, 63 CUI Devices	2,478	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.500 (63.50mm)	1.654 (42.00mm)	-	0.984 (25.00mm)	13.7W @ 75°C	2.78°C/W @ 200 LFM	5.47°C/W	Aluminum Alloy
HSB22-606010 HEAT SINK, BGA, 60 X 60 X 10 MM CUI Devices	3,077	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	2.362 (60.00mm)	2.362 (60.00mm)	-	0.394 (10.00mm)	9.8W @ 75°C	2.60°C/W @ 200 LFM	7.62°C/W	Aluminum
VHS-45 HEATSINK HALF BRICK ALUM BLACK CUI Devices	2,723	-	RFQ	Ficha técnica	Box	-	Obsolete	Board Level	Bolt On	Square, Fins	2.402 (61.00mm)	2.264 (57.50mm)	-	0.450 (11.43mm)	-	4.60°C/W @ 200 LFM	10.30°C/W	Aluminum
VHS-95 HEATSINK HALF BRICK ALUM BLACK CUI Devices	3,783	-	RFQ	Ficha técnica	Box	-	Obsolete	Board Level	Bolt On	Square, Fins	2.402 (61.00mm)	2.283 (58.00mm)	-	0.940 (23.88mm)	-	2.10°C/W @ 200 LFM	4.70°C/W	Aluminum
HSS-B20-0452H HEATSINK TO-220 3.2W ALUMINUM CUI Devices	3,863	-	RFQ	Ficha técnica	Bag	HSS	Obsolete	Board Level, Vertical	PC Pin	Rectangular, Fins	0.500 (12.70mm)	0.500 (12.70mm)	-	0.748 (19.00mm)	3.2W @ 75°C	6.40°C/W @ 200 LFM	23.81°C/W	Aluminum