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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSE01-193175 HEAT SINK, EXTRUSION, 19 X 31.5 CUI Devices	1,580	-	RFQ	Ficha técnica	Box	HSE	Active	Top Mount	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.748 (19.00mm)	0.748 (19.00mm)	-	0.295 (7.50mm)	2.95W @ 75°C	9.20°C/W @ 200 LFM	25.44°C/W	Aluminum Alloy
HSS07-C20-P274 HEAT SINK, STAMPING, TO-220, 21. CUI Devices	1,890	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	PC Pin	Rectangular	0.853 (21.66mm)	0.520 (13.21mm)	-	0.515 (13.08mm)	2.5W @ 75°C	12.60°C/W @ 200 LFM	29.57°C/W	Copper Alloy
HSB23-232325 HEAT SINK, BGA, 23 X 23 X 25 MM CUI Devices	1,202	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.906 (23.00mm)	0.906 (23.00mm)	-	0.984 (25.00mm)	6.13W @ 75°C	3.80°C/W @ 200 LFM	12.23°C/W	Aluminum Alloy
HSE05-171933 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	3,230	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level	PC Pin	Rectangular, Angled Fins	0.764 (19.40mm)	0.669 (17.00mm)	-	1.280 (32.50mm)	3.98W @ 75°C	6.90°C/W @ 200 LFM	18.83°C/W	Aluminum Alloy
HSE02-173213 HEAT SINK, EXTRUSION, 17 X 31.9 CUI Devices	1,542	-	RFQ	Ficha técnica	Box	HSE	Active	Top Mount	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.669 (17.00mm)	0.669 (17.00mm)	-	0.492 (12.50mm)	3.5W @ 75°C	6.70°C/W @ 200 LFM	21.44°C/W	Aluminum Alloy
HSE01-193175P HEAT SINK, EXTRUSION, 19 X 31.5 CUI Devices	1,584	-	RFQ	Ficha técnica	Box	HSE	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Angled Fins	0.748 (19.00mm)	0.748 (19.00mm)	-	0.295 (7.50mm)	2.95W @ 75°C	9.20°C/W @ 200 LFM	25.44°C/W	Aluminum Alloy
HSB30-373710 HEAT SINK, BGA, 37.4 X 37 X 10 M CUI Devices	665	-	RFQ	Ficha técnica	Box	HSB	Active	-	-	-	-	-	-	-	-	-	-	-
HSE06-503045 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	1,197	-	RFQ	Ficha técnica	Bag	HSE	Active	Board Level	Clip	Rectangular, Fins	1.969 (50.00mm)	1.181 (30.00mm)	-	1.772 (45.00mm)	12.79W @ 75°C	2.10°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy
HSE08-505028 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	1,118	-	RFQ	Ficha técnica	Bag	HSE	Active	Board Level	Clip	Rectangular, Angled Fins	1.969 (50.00mm)	1.102 (28.00mm)	-	1.969 (50.00mm)	10.53W @ 75°C	2.70°C/W @ 200 LFM	7.13°C/W	Aluminum Alloy
HSB27-434316 HEAT SINK, BGA, 43.1 X 43.1 X 16 CUI Devices	1,081	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.697 (43.10mm)	1.697 (43.10mm)	-	0.650 (16.51mm)	8.98W @ 75°C	2.80°C/W @ 200 LFM	8.35°C/W	Aluminum Alloy
HSE02-173213P HEAT SINK, EXTRUSION, 17 X 31.9 CUI Devices	1,572	-	RFQ	Ficha técnica	Box	HSE	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Angled Fins	0.669 (17.00mm)	0.669 (17.00mm)	-	0.492 (12.50mm)	3.5W @ 75°C	6.70°C/W @ 200 LFM	21.44°C/W	Aluminum Alloy
HSE07-753045 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	993	-	RFQ	Ficha técnica	Bag	HSE	Active	Board Level	Clip	Rectangular, Fins	2.953 (75.00mm)	1.181 (30.00mm)	-	1.772 (45.00mm)	15.46W @ 75°C	2.10°C/W @ 200 LFM	4.85°C/W	Aluminum Alloy
HSE09-755028 HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	999	-	RFQ	Ficha técnica	Bag	HSE	Active	Board Level	Clip	Rectangular, Angled Fins	2.953 (75.00mm)	1.102 (28.00mm)	-	1.969 (50.00mm)	13.26W @ 75°C	2.50°C/W @ 200 LFM	5.66°C/W	Aluminum Alloy
HSS-B20-CP-01 HEATSINK TO-220 2.6W ALUMINUM CUI Devices	545	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level	Clip	Rectangular, Fins	0.375 (9.53mm)	0.900 (22.86mm)	-	0.740 (18.79mm)	2.6W @ 75°C	6.32°C/W @ 200 LFM	28.85°C/W	Aluminum
HSE-B20250-040H-01 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	616	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	PC Pin	Rectangular, Angled Fins	0.984 (25.00mm)	1.359 (34.50mm)	-	0.492 (12.50mm)	5.5W @ 75°C	4.44°C/W @ 200 LFM	13.64°C/W	Aluminum Alloy
HSB06-181810 HEAT SINK, BGA, 18 X 18 X 10 MM CUI Devices	780	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.709 (18.00mm)	0.709 (18.00mm)	-	0.394 (10.00mm)	3.2W @ 75°C	18.80°C/W @ 200 LFM	23.68°C/W	Aluminum Alloy
HSS13-B20-NP HEAT SINK, STAMPING, TO-220, 31 CUI Devices	646	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	-	Rectangular	1.220 (31.00mm)	0.994 (25.25mm)	-	0.508 (12.90mm)	4.8W @ 75°C	7.70°C/W @ 200 LFM	15.50°C/W	Aluminum Alloy
HSB19-272718 HEAT SINK, BGA, 27 X 27 X 18 MM CUI Devices	239	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.063 (27.00mm)	1.063 (27.00mm)	-	0.709 (18.00mm)	6.8W @ 75°C	4.50°C/W @ 200 LFM	11.11°C/W	Aluminum Alloy
HSS-B20-NPR-02 HEATSINK TO-220 5.1W ALUMINUM CUI Devices	712	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	Bolt On and Board Mounts	Rectangular, Fins	0.500 (12.70mm)	1.000 (25.40mm)	-	1.180 (29.97mm)	5.1W @ 75°C	4.20°C/W @ 200 LFM	14.71°C/W	Aluminum
HSE-B254-045H HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	703	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.772 (45.00mm)	-	0.500 (12.70mm)	6.4W @ 75°C	3.86°C/W @ 200 LFM	11.72°C/W	Aluminum Alloy