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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSS-B20-0953H-02 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	315	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.500 (12.70mm)	0.504 (12.80mm)	-	0.748 (19.00mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum
HSS-B20-NP-07 HEATSINK TO-220 2.3W ALUMINUM CUI Devices	154	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	-	Rectangular, Fins	0.591 (15.00mm)	0.504 (12.80mm)	-	0.500 (12.70mm)	2.3W @ 75°C	11.04°C/W @ 200 LFM	33.28°C/W	Aluminum
HSS-B20-0635H-02 HEATSINK TO-220 2.6W ALUMINUM CUI Devices	415	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.520 (13.20mm)	0.500 (12.70mm)	-	0.748 (19.00mm)	2.6W @ 75°C	10.49°C/W @ 200 LFM	29.09°C/W	Aluminum
HSS-B20-NPS-02 HEATSINK TO-220 5.1W ALUMINUM CUI Devices	557	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On and Board Mounts	Rectangular, Fins	0.500 (12.70mm)	1.000 (25.40mm)	-	1.180 (29.97mm)	5.1W @ 75°C	4.20°C/W @ 200 LFM	14.71°C/W	Aluminum
HSS-B20-NPR-01 HEATSINK TO-220 4.2W ALUMINUM CUI Devices	503	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On	Rectangular, Fins	1.180 (29.97mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	4.2W @ 75°C	5.88°C/W @ 200 LFM	17.74°C/W	Aluminum
HSS-B20-NP-10 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	283	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	-	Rectangular, Fins	0.748 (19.00mm)	0.504 (12.80mm)	-	0.500 (12.70mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum
HSS-B20-NPS-01 HEATSINK TO-220 4.2W ALUMINUM CUI Devices	323	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On	Rectangular, Fins	1.180 (29.97mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	4.2W @ 75°C	5.88°C/W @ 200 LFM	17.74°C/W	Aluminum
HSS-B20-0508H-01S HEATSINK TO-220 4.7W ALUMINUM CUI Devices	760	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On and Board Mounts	Rectangular, Fins	0.500 (12.70mm)	1.000 (25.40mm)	-	1.180 (29.97mm)	4.7W @ 75°C	5.87°C/W @ 200 LFM	15.83°C/W	Aluminum
HSS-B20-NP HEATSINK TO-220 4W ALUMINUM CUI Devices	156	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level	-	Rectangular, Fins	1.500 (38.10mm)	0.504 (12.80mm)	-	0.500 (12.70mm)	4.0W @ 75°C	5.01°C/W @ 200 LFM	18.63°C/W	Aluminum
HSS-C2540-SMT-TR HEAT SINK TO-263 COPPER CUI Devices	300	-	RFQ	Ficha técnica	Tape & Reel (TR),Cut Tape (CT)	HSS	Active	Board Level	-	Rectangular, Fins	0.763 (19.38mm)	1.000 (25.40mm)	-	0.450 (11.43mm)	3.8W @ 75°C	5.50°C/W @ 200 LFM	21.90°C/W	Copper
HSS-B20-061H-02 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	214	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.500 (12.70mm)	0.504 (12.80mm)	-	0.748 (19.00mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum
HSS-B20-095H HEATSINK TO-220 4.1W ALUMINUM CUI Devices	338	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.441 (11.20mm)	0.866 (22.00mm)	-	0.626 (15.90mm)	4.1W @ 75°C	6.50°C/W @ 200 LFM	18.34°C/W	Aluminum
HSB13-303014 HEAT SINK, BGA, 30.7 X 30.7 X 14 CUI Devices	524	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.209 (30.70mm)	1.209 (30.70mm)	-	0.551 (14.00mm)	6.1W @ 75°C	4.70°C/W @ 200 LFM	12.36°C/W	Aluminum Alloy
HSS-B20-NP-15 HEATSINK TO-220 4.1W ALUMINUM CUI Devices	376	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	-	Rectangular, Fins	0.625 (15.90mm)	0.866 (22.00mm)	-	0.440 (11.18mm)	4.1W @ 75°C	6.50°C/W @ 200 LFM	18.34°C/W	Aluminum
HSS06-C20-P32 HEAT SINK, STAMPING, TO-220, 27. CUI Devices	439	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	PC Pin	Rectangular	1.101 (27.96mm)	0.866 (22.00mm)	-	0.375 (9.52mm)	3.0W @ 75°C	10.60°C/W @ 200 LFM	25.35°C/W	Copper Alloy
HSS08-B18-CP HEAT SINK, STAMPING, TO-218, 44. CUI Devices	990	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	PC Pin	Square	1.750 (44.45mm)	1.750 (44.45mm)	-	0.492 (12.50mm)	10.3W @ 75°C	3.50°C/W @ 200 LFM	7.29°C/W	Aluminum Alloy
HSE-B18254-035H HEAT SINK, EXTRUSION, TO-218, 25 CUI Devices	610	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.638 (41.60mm)	-	0.984 (25.00mm)	8.1W @ 75°C	3.09°C/W @ 200 LFM	9.26°C/W	Aluminum Alloy
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM CUI Devices	3,713	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.827 (21.00mm)	0.827 (21.00mm)	-	0.236 (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices	3,353	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.827 (21.00mm)	0.827 (21.00mm)	-	0.591 (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M CUI Devices	3,624	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.669 (17.00mm)	0.669 (17.00mm)	-	0.453 (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy