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Térmico - Disipadores de calor

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSE-B20254-056H HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	930	-	RFQ	Ficha técnica	Bulk,Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	5.5W @ 75°C	8.36°C/W @ 200 LFM	13.64°C/W	Aluminum Alloy
HSB15-404010 HEAT SINK, BGA, 40 X 40 X 10 MM CUI Devices	2,688	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.575 (40.00mm)	1.575 (40.00mm)	-	0.394 (10.00mm)	6.3W @ 75°C	3.90°C/W @ 200 LFM	11.84°C/W	Aluminum Alloy
HSE-B18254-0396H HEAT SINK, EXTRUSION,TO-218, 25. CUI Devices	568	-	RFQ	Ficha técnica	Bulk,Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	1.000 (25.40mm)	1.654 (42.00mm)	-	0.984 (25.00mm)	8.2W @ 75°C	2.29°C/W @ 200 LFM	9.15°C/W	Aluminum Alloy
HSE-B18508-035H HEAT SINK, EXTRUSION, TO-218, 50 CUI Devices	2,822	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Angled Fins	2.000 (50.80mm)	1.638 (41.60mm)	-	0.984 (25.00mm)	12.8W @ 75°C	2.98°C/W @ 200 LFM	5.86°C/W	Aluminum Alloy
HSB20-353525 HEAT SINK, BGA, 35 X 35 X 25 MM CUI Devices	2,047	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.378 (35.00mm)	1.378 (35.00mm)	-	0.984 (25.00mm)	11.3W @ 75°C	2.70°C/W @ 200 LFM	6.65°C/W	Aluminum Alloy
HSE11-B20-NP HEAT SINK, EXTRUSION, TO-218/TO- CUI Devices	2,111	-	RFQ	Ficha técnica	Bag	HSE	Active	Top Mount	Bolt On	Rectangular	0.984 (25.00mm)	0.472 (12.00mm)	-	0.177 (4.50mm)	1.93W @ 75°C	21.40°C/W @ 200 LFM	38.90°C/W	Aluminum Alloy
HSS-B20-NP-11 HEATSINK TO-220 4.4W ALUMINUM CUI Devices	3,477	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On	Rectangular, Fins	0.700 (17.78mm)	0.779 (19.80mm)	-	0.850 (21.60mm)	4.4W @ 75°C	6.86°C/W @ 200 LFM	17.05°C/W	Aluminum
HSS-B20-074H HEATSINK TO-220 3.6W ALUMINUM CUI Devices	3,050	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Fins	0.394 (10.00mm)	0.830 (21.08mm)	-	0.748 (19.00mm)	3.6W @ 75°C	5.39°C/W @ 200 LFM	20.59°C/W	Aluminum
HSS-C2591-SMT-TR HEAT SINK TO-263 COPPER CUI Devices	2,670	-	RFQ	Ficha técnica	Tape & Reel (TR)	HSS	Active	Top Mount	-	Rectangular, Fins	0.591 (15.00mm)	1.020 (25.91mm)	-	0.375 (9.52mm)	2.1W @ 75°C	8.15°C/W @ 200 LFM	35.71°C/W	Copper
HSS-B20-NP-01 HEATSINK TO-220 4.1W ALUMINUM CUI Devices	2,585	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	-	Rectangular, Fins	0.787 (20.00mm)	0.775 (19.68mm)	-	0.303 (7.70mm)	4.1W @ 75°C	7.05°C/W @ 200 LFM	18.29°C/W	Aluminum
HSS-B20-NP-03 HEATSINK TO-220 3.6W ALUMINUM CUI Devices	2,195	-	RFQ	Ficha técnica	Bag	HSS	Active	Top Mount	-	Rectangular, Fins	0.279 (7.10mm)	0.787 (20.00mm)	-	1.000 (25.40mm)	3.6W @ 75°C	7.45°C/W @ 200 LFM	20.83°C/W	Aluminum
HSS-B20-061H-01 HEATSINK TO-220 2.3W ALUMINUM CUI Devices	2,601	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	PC Pin	Rectangular, Fins	0.500 (12.70mm)	0.504 (12.80mm)	-	0.590 (15.00mm)	2.3W @ 75°C	11.04°C/W @ 200 LFM	33.28°C/W	Aluminum
HSS-B20-NP-02 HEATSINK TO-220 3.6W ALUMINUM CUI Devices	2,169	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	-	Rectangular, Fins	0.748 (19.00mm)	0.830 (21.08mm)	-	0.394 (10.00mm)	3.6W @ 75°C	5.39°C/W @ 200 LFM	20.59°C/W	Aluminum
HSE-B1711-057 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	3,787	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level	Bolt On	Rectangular, Fins	0.984 (25.00mm)	0.625 (16.00mm)	-	0.354 (9.00mm)	3.1W @ 75°C	7.07°C/W @ 200 LFM	24.19°C/W	Aluminum Alloy
HSE-B1711-032 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	3,410	-	RFQ	Ficha técnica	Box	HSE	Active	Board Level	Bolt On	Rectangular, Fins	0.984 (25.00mm)	0.625 (16.00mm)	-	0.354 (9.00mm)	3.7W @ 75°C	6.84°C/W @ 200 LFM	20.27°C/W	Aluminum Alloy
HSS-B20-043H-01 HEATSINK TO-220 2.9W ALUMINUM CUI Devices	3,211	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level, Vertical	PC Pin	Rectangular, Angled Fins	0.211 (5.35mm)	0.874 (22.20mm)	-	1.250 (31.75mm)	2.9W @ 75°C	8.18°C/W @ 200 LFM	26.13°C/W	Aluminum
HSS-B20-NP-14 HEATSINK TO-220 4.4W ALUMINUM CUI Devices	3,797	-	RFQ	Ficha técnica	Bag	HSS	Active	Top Mount	Clip and Board Mounts	Rectangular, Fins	0.375 (9.53mm)	0.985 (25.00mm)	-	0.961 (24.40mm)	4.4W @ 75°C	4.51°C/W @ 200 LFM	17.05°C/W	Aluminum
HSS-B20-NP-13 HEATSINK TO-220 3.9W ALUMINUM CUI Devices	3,037	-	RFQ	Ficha técnica	Bag	HSS	Active	Board Level	Bolt On	Rectangular, Fins	0.700 (17.78mm)	1.750 (44.45mm)	-	0.375 (9.52mm)	3.9W @ 75°C	5.88°C/W @ 200 LFM	19.22°C/W	Aluminum
HSS21-B20-P53 HEAT SINK, STAMPING, TO-218/TO-2 CUI Devices	3,164	-	RFQ	Ficha técnica	Box	HSS	Active	Board Level	PC Pin	Rectangular, Fins	1.000 (25.40mm)	0.961 (24.40mm)	-	0.500 (12.70mm)	3.58W @ 75°C	10.10°C/W @ 200 LFM	20.93°C/W	Aluminum Alloy
HSB01-080808 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM CUI Devices	2,560	-	RFQ	Ficha técnica	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.335 (8.50mm)	0.335 (8.50mm)	-	0.315 (8.00mm)	1.9W @ 75°C	16.00°C/W @ 200 LFM	39.10°C/W	Aluminum Alloy