Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-636-41-012101

116-83-636-41-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,780 -

RFQ

116-83-636-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-018101

116-83-642-41-018101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,762 -

RFQ

116-83-642-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-964-41-001101

110-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,435 -

RFQ

110-83-964-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-636-41-035101

146-83-636-41-035101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,888 -

RFQ

146-83-636-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-636-41-036101

146-83-636-41-036101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,133 -

RFQ

146-83-636-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-041101

510-87-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
2,002 -

RFQ

510-87-128-13-041101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-042101

510-87-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
3,613 -

RFQ

510-87-128-13-042101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-043101

510-87-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
2,056 -

RFQ

510-87-128-13-043101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-071101

510-87-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
3,443 -

RFQ

510-87-128-13-071101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-001101

116-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,898 -

RFQ

116-83-628-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-076-11-041101

510-83-076-11-041101

CONN SOCKET PGA 76POS GOLD

Preci-Dip
3,354 -

RFQ

510-83-076-11-041101

Ficha técnica

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-964-41-001101

614-87-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
2,076 -

RFQ

614-87-964-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-008101

116-83-432-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,365 -

RFQ

116-83-432-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-008101

116-87-636-41-008101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,209 -

RFQ

116-87-636-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-008101

116-87-640-41-008101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,950 -

RFQ

116-87-640-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-10-001101

510-83-084-10-001101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,125 -

RFQ

510-83-084-10-001101

Ficha técnica

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-10-031101

510-83-084-10-031101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,776 -

RFQ

510-83-084-10-031101

Ficha técnica

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-11-002101

510-83-084-11-002101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,504 -

RFQ

510-83-084-11-002101

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-11-041101

510-83-084-11-041101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,191 -

RFQ

510-83-084-11-041101

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-11-042101

510-83-084-11-042101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,444 -

RFQ

510-83-084-11-042101

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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