Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-628-41-105191

110-83-628-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,201 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-061101

510-87-121-13-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,681 -

RFQ

510-87-121-13-061101

Ficha técnica

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-15-001101

510-87-121-15-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,988 -

RFQ

510-87-121-15-001101

Ficha técnica

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-15-061101

510-87-121-15-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,895 -

RFQ

510-87-121-15-061101

Ficha técnica

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-001101

510-83-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,510 -

RFQ

510-83-072-11-001101

Ficha técnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-041101

510-83-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,865 -

RFQ

510-83-072-11-041101

Ficha técnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-061101

510-83-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip
2,798 -

RFQ

510-83-072-11-061101

Ficha técnica

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-11-000101

510-87-121-11-000101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,393 -

RFQ

510-87-121-11-000101

Ficha técnica

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-001101

510-87-121-13-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,572 -

RFQ

510-87-121-13-001101

Ficha técnica

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-041101

510-87-121-13-041101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,682 -

RFQ

510-87-121-13-041101

Ficha técnica

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-018101

116-83-640-41-018101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,694 -

RFQ

116-83-640-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-006101

116-83-642-41-006101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,424 -

RFQ

116-83-642-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-009101

116-87-636-41-009101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,586 -

RFQ

116-87-636-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-003101

116-87-652-41-003101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,132 -

RFQ

116-87-652-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-073-11-061101

510-83-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip
3,854 -

RFQ

510-83-073-11-061101

Ficha técnica

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-105161

110-83-642-41-105161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,933 -

RFQ

110-83-642-41-105161

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-013101

116-87-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,525 -

RFQ

116-87-318-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-320-11-001101

299-83-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,665 -

RFQ

299-83-320-11-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-124-13-041101

510-87-124-13-041101

CONN SOCKET PGA 124POS GOLD

Preci-Dip
3,981 -

RFQ

510-87-124-13-041101

Ficha técnica

Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-004101

116-83-322-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,912 -

RFQ

116-83-322-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 7778798081828384...142Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario