Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-068-11-062101

510-83-068-11-062101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,408 -

RFQ

510-83-068-11-062101

Ficha técnica

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-952-41-005101

110-83-952-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,529 -

RFQ

110-83-952-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-018101

116-87-652-41-018101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,049 -

RFQ

116-87-652-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-950-31-012101

614-87-950-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,550 -

RFQ

614-87-950-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-650-31-012101

614-87-650-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,602 -

RFQ

614-87-650-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-952-41-001101

614-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,360 -

RFQ

614-87-952-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-006101

116-83-640-41-006101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,996 -

RFQ

116-83-640-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-640-41-035101

146-87-640-41-035101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,993 -

RFQ

146-87-640-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-640-41-036101

146-87-640-41-036101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,636 -

RFQ

146-87-640-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-069-11-001101

510-83-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip
3,105 -

RFQ

510-83-069-11-001101

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-069-11-061101

510-83-069-11-061101

CONN SOCKET PGA 69POS GOLD

Preci-Dip
2,916 -

RFQ

510-83-069-11-061101

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-001101

116-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,264 -

RFQ

116-87-432-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-001101

116-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,574 -

RFQ

116-87-632-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-105101

110-83-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,078 -

RFQ

110-83-642-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-081-09-000101

510-83-081-09-000101

CONN SOCKET PGA 81POS GOLD

Preci-Dip
3,667 -

RFQ

510-83-081-09-000101

Ficha técnica

Bulk 510 Active PGA 81 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-640-41-105101

117-83-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,100 -

RFQ

117-83-640-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-001101

116-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,499 -

RFQ

116-83-328-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-001101

116-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,195 -

RFQ

116-83-428-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-432-41-001101

121-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,990 -

RFQ

121-83-432-41-001101

Ficha técnica

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-105191

110-83-328-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,844 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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