Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-636-41-002101

116-83-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,426 -

RFQ

116-83-636-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-009101

116-83-432-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,492 -

RFQ

116-83-432-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-001101

116-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,573 -

RFQ

116-87-636-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-001101

510-83-085-13-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
2,391 -

RFQ

510-83-085-13-001101

Ficha técnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-042101

510-83-085-13-042101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,234 -

RFQ

510-83-085-13-042101

Ficha técnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-13-081101

510-83-085-13-081101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
2,998 -

RFQ

510-83-085-13-081101

Ficha técnica

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-448-41-105101

117-83-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,288 -

RFQ

117-83-448-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-008101

116-87-642-41-008101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,445 -

RFQ

116-87-642-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-004101

116-83-324-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,414 -

RFQ

116-83-324-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-004101

116-83-424-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,875 -

RFQ

116-83-424-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-12-000101

510-87-144-12-000101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
2,132 -

RFQ

510-87-144-12-000101

Ficha técnica

Bulk 510 Active PGA 144 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-13-001101

510-87-144-13-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,036 -

RFQ

510-87-144-13-001101

Ficha técnica

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-13-041101

510-87-144-13-041101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
2,782 -

RFQ

510-87-144-13-041101

Ficha técnica

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-009101

116-87-640-41-009101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,879 -

RFQ

116-87-640-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-14-001101

510-87-132-14-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,040 -

RFQ

510-87-132-14-001101

Ficha técnica

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-13-041101

510-87-145-13-041101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,562 -

RFQ

510-87-145-13-041101

Ficha técnica

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-081-12-071101

510-83-081-12-071101

CONN SOCKET PGA 81POS GOLD

Preci-Dip
2,689 -

RFQ

510-83-081-12-071101

Ficha técnica

Bulk 510 Active PGA 81 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-952-41-001101

612-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,759 -

RFQ

612-87-952-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-14-071101

510-87-133-14-071101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,730 -

RFQ

510-87-133-14-071101

Ficha técnica

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-013101

116-83-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,374 -

RFQ

116-83-318-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+ Promedio diario de RFQ
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20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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