Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-83-632-41-035101

146-83-632-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,105 -

RFQ

146-83-632-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-632-41-036101

146-83-632-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,700 -

RFQ

146-83-632-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-003101

116-87-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,184 -

RFQ

116-87-650-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-424-41-002101

124-83-424-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,822 -

RFQ

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-624-41-002101

124-83-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,556 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-650-41-003101

115-83-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,314 -

RFQ

115-83-650-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-009101

116-83-428-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,904 -

RFQ

116-83-428-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-009101

116-83-628-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,577 -

RFQ

116-83-628-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-642-41-001101

612-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,172 -

RFQ

612-83-642-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-007101

116-87-636-41-007101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,660 -

RFQ

116-87-636-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-652-41-001101

612-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,801 -

RFQ

612-87-652-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-120-13-001101

510-87-120-13-001101

CONN SOCKET PGA 120POS GOLD

Preci-Dip
3,929 -

RFQ

510-87-120-13-001101

Ficha técnica

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-120-13-061101

510-87-120-13-061101

CONN SOCKET PGA 120POS GOLD

Preci-Dip
2,242 -

RFQ

510-87-120-13-061101

Ficha técnica

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-011101

116-83-424-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,743 -

RFQ

116-83-424-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-011101

116-83-624-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,620 -

RFQ

116-83-624-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-652-31-012101

614-87-652-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,872 -

RFQ

614-87-652-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-952-31-012101

614-87-952-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,497 -

RFQ

614-87-952-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-007101

116-83-632-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,870 -

RFQ

116-83-632-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-007101

116-83-432-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,859 -

RFQ

116-83-432-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-652-41-105101

117-87-652-41-105101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,686 -

RFQ

117-87-652-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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