Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-328-41-004101

116-87-328-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,902 -

RFQ

116-87-328-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-004101

116-87-428-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,569 -

RFQ

116-87-428-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-013101

116-83-316-41-013101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,138 -

RFQ

116-83-316-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-002101

116-87-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,617 -

RFQ

116-87-642-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-648-41-001101

614-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,213 -

RFQ

614-83-648-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-636-41-001101

122-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,217 -

RFQ

122-83-636-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-636-41-001101

123-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,447 -

RFQ

123-83-636-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-320-10-001101

299-83-320-10-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,583 -

RFQ

299-83-320-10-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-950-41-001101

612-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,574 -

RFQ

612-87-950-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-642-31-012101

614-83-642-31-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,121 -

RFQ

614-83-642-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-636-41-001101

121-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,882 -

RFQ

121-83-636-41-001101

Ficha técnica

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-13-001101

510-87-132-13-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,046 -

RFQ

510-87-132-13-001101

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-13-002101

510-87-132-13-002101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,587 -

RFQ

510-87-132-13-002101

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-13-041101

510-87-132-13-041101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,796 -

RFQ

510-87-132-13-041101

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-13-042101

510-87-132-13-042101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,219 -

RFQ

510-87-132-13-042101

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-007101

116-87-640-41-007101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,708 -

RFQ

116-87-640-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-642-41-001101

122-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,881 -

RFQ

122-87-642-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-642-41-001101

123-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,284 -

RFQ

123-87-642-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-008101

116-83-632-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,775 -

RFQ

116-83-632-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-012101

116-87-648-41-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,022 -

RFQ

116-87-648-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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