Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-422-41-004101

116-83-422-41-004101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,616 -

RFQ

116-83-422-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-616-10-002101

299-87-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,343 -

RFQ

299-87-616-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-124-13-001101

510-87-124-13-001101

CONN SOCKET PGA 124POS GOLD

Preci-Dip
2,047 -

RFQ

510-87-124-13-001101

Ficha técnica

Bulk 510 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-002101

116-87-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,472 -

RFQ

116-87-636-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-125-13-041101

510-87-125-13-041101

CONN SOCKET PGA 125POS GOLD

Preci-Dip
3,024 -

RFQ

510-87-125-13-041101

Ficha técnica

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-002101

116-83-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,137 -

RFQ

116-83-432-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-002101

116-83-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,336 -

RFQ

116-83-632-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-324-11-001101

299-87-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,888 -

RFQ

299-87-324-11-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-614-10-002101

299-83-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,937 -

RFQ

299-83-614-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-640-41-001101

122-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,368 -

RFQ

122-87-640-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-640-41-001101

123-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,026 -

RFQ

123-87-640-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-10-031101

510-83-085-10-031101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
2,028 -

RFQ

510-83-085-10-031101

Ficha técnica

Bulk 510 Active PGA 85 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-001101

510-83-085-11-001101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,062 -

RFQ

510-83-085-11-001101

Ficha técnica

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-041101

510-83-085-11-041101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,228 -

RFQ

510-83-085-11-041101

Ficha técnica

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-044101

510-83-085-11-044101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
2,951 -

RFQ

510-83-085-11-044101

Ficha técnica

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-085-11-045101

510-83-085-11-045101

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,071 -

RFQ

510-83-085-11-045101

Ficha técnica

Bulk 510 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-075-11-001101

510-83-075-11-001101

CONN SOCKET PGA 75POS GOLD

Preci-Dip
2,501 -

RFQ

510-83-075-11-001101

Ficha técnica

Bulk 510 Active PGA 75 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-642-41-105101

117-83-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,295 -

RFQ

117-83-642-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-004101

116-87-624-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,506 -

RFQ

116-87-624-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-003101

116-83-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,293 -

RFQ

116-83-640-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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