Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-648-31-012101

614-87-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,437 -

RFQ

614-87-648-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-018101

116-87-650-41-018101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,846 -

RFQ

116-87-650-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-324-41-001101

123-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,919 -

RFQ

123-83-324-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-648-41-105101

117-87-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,056 -

RFQ

117-87-648-41-105101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-318-11-001101

299-83-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,525 -

RFQ

299-83-318-11-001101

Ficha técnica

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-652-41-005101

110-83-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,285 -

RFQ

110-83-652-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-640-41-001101

612-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,234 -

RFQ

612-83-640-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-964-41-005101

110-87-964-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,829 -

RFQ

110-87-964-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-656-41-005101

117-83-656-41-005101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip
3,440 -

RFQ

117-83-656-41-005101

Ficha técnica

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-008101

116-83-428-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,716 -

RFQ

116-83-428-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-008101

116-83-628-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,259 -

RFQ

116-83-628-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-012101

116-87-642-41-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,149 -

RFQ

116-87-642-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-011101

116-87-428-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,966 -

RFQ

116-87-428-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-011101

116-87-628-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,385 -

RFQ

116-87-628-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-011101

116-87-328-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,028 -

RFQ

116-87-328-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-004101

116-83-320-41-004101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,982 -

RFQ

116-83-320-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-004101

116-83-420-41-004101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,826 -

RFQ

116-83-420-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-003101

116-87-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,184 -

RFQ

116-87-648-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-648-41-003101

115-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,444 -

RFQ

115-83-648-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-012101

116-83-432-41-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,668 -

RFQ

116-83-432-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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