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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD2SWLT.047 1OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 Chip Quik Inc. |
3,490 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
NC191LTA15T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,240 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMD291SNLSOLDER PASTE NO-CLEAN LF 5CC SYR Chip Quik Inc. |
2,893 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMDSWLT.047 1OZSOLDER WIRE SN42/BI57/AG1 .047 Chip Quik Inc. |
3,561 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - |
|
TS391SNLTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,833 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
TS391SNL50THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,361 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
NC191LTA50SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,830 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
TS391LT50THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,510 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD2050-25000SOLDER SPHERES SAC305 .024 DIAM Chip Quik Inc. |
2,054 | - |
RFQ |
Ficha técnica |
Jar | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024 (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
TS391AX10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,639 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
TS391LT10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,648 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD4300AX10T5SOLDER PASTE WATER SOL T5 10CC Chip Quik Inc. |
2,740 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
TS391SNL10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,131 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD4300SNL10T5SLD PASTE LF WATER SOL T5 10CC Chip Quik Inc. |
3,737 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLF.015 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,581 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
TS991AX35T4THERMALLY STABLE SOLDER PASTE NC Chip Quik Inc. |
3,310 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
|
SMD4300AX250T3SOLDER PASTE SN63/PB37 250G Chip Quik Inc. |
2,538 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD3SW.031 8OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,124 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMD291SNLT6SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
3,020 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 6 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
TS391AX250THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,254 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
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