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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC2SWLF.020 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,565 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
EXB-SN96.5AG3.0CU0.5SOLDER BAR SN96.5/AG3.0/CU0.5 1L Chip Quik Inc. |
3,363 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
SMD3SWLT.047 8OZSOLDER WIRE SN42/BI58 .047 8OZ Chip Quik Inc. |
3,449 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMDIN100-RINDIUM SOLDER RIBBON (IN100) 0.0 Chip Quik Inc. |
3,056 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Ribbon Solder | In100 (100) | - | 315°F (157°C) | - | - | - | Lead Free | Spool | - | - |
|
SMD2SWLT.047 8OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 Chip Quik Inc. |
3,076 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC191LTA250T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,712 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMDLTLFP250T3SOLDER PASTE SN42/BI58 250G Chip Quik Inc. |
3,480 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
NC3SW.031 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3,293 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031 (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMDSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,705 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
TS991SNL500T4SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
2,871 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
WS991LT500T4SOLDER PASTE THERMALLY STABLE WS Chip Quik Inc. |
3,514 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
TS391AX500CTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,883 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD2SWLF.031 .7OZLF SOLDER WIRE POCKET PACK 99.3/ Chip Quik Inc. |
3,500 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - |
|
RASW.031 4OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,794 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLF.031 .7OZLF SOLDER WIRE POCKET PACK 96.5/ Chip Quik Inc. |
3,169 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - |
|
SMD2SW.031 2OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,247 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD2SW.020 2OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,829 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD4300SNL10T4SLDR PST WATR SOL SAC305 T4 10CC Chip Quik Inc. |
3,623 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLT.040 20GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
2,817 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
|
NC191SNL50T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
3,561 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
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