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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191LTA50T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,458 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD4300SNL250T5SOLDER PASTE SAC305 250G T5 Chip Quik Inc. |
3,773 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
TS991SNL500T3SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
3,255 | - |
RFQ |
Ficha técnica |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMDSW.020 .4OZSOLDER WIRE POCKET PACK 63/37 TI Chip Quik Inc. |
3,315 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Tube, 0.4 oz (11.34g) | - | - |
|
BARSN63PB37-8OZSOLDER BAR SN63/PB37 8OZ 227G SU Chip Quik Inc. |
2,005 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - |
|
BARSN60PB40-8OZSOLDER BAR SN60/PB40 8OZ 227G SU Chip Quik Inc. |
2,354 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - |
|
SMDLTLFP15T4TWO PART MIX SOLDER PASTE Chip Quik Inc. |
2,849 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste, Two Part Mix | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 0.53 oz (15g) | 24 Months | Date of Manufacture |
|
SMD2SWLF.020 4OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,147 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
BARSN60PB40SOLDER BAR SN60/PB40 1LB SUPER L Chip Quik Inc. |
3,237 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - |
|
BARSN62PB36AG2-8OZSOLDER BAR SN62/PB36/AG2 8OZ 227 Chip Quik Inc. |
3,405 | - |
RFQ |
Ficha técnica |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - |
|
SMDAG100-S-1SOLDER SHOT AG100 1OZ 28G Chip Quik Inc. |
2,542 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Shot | Ag100(100) | - | 1762°F (961°C) | - | - | - | Lead Free | Bag, 1 oz (28g) | - | - |
|
SMD2150SOLDER SPHERES SN63/PB37 .010 ( Chip Quik Inc. |
2,607 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.010 (0.25mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD3SWLT.040 100GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
2,305 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.5 oz (100g) | - | - |
|
SMD2SWLT.040 100GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
2,363 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.5 oz (100g) | - | - |
|
SMDLTLFP500T3CSOLDER PASTE LOW TEMP T3 500G Chip Quik Inc. |
2,480 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
NC3SWLF.031 1LBLF SOLDER WIRE 96.5/3.5 TIN/SILV Chip Quik Inc. |
2,784 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.031 (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
NCSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,654 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMDSWLF.020 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,911 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD4300SNL500T5CSOLDER PASTE SAC305 T5 500G Chip Quik Inc. |
3,569 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMDIN100-S-16SOLDER SHOT IN100 16OZ 454G Chip Quik Inc. |
2,932 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Shot | In100 (100) | - | 315°F (157°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - |
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