+86 075582561136
Subir BOM
Soldadura
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD2060SOLDER SPHERES SAC305 .030 DIAM Chip Quik Inc. |
2,114 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.030 (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2050SOLDER SPHERES SAC305 .024 DIAM Chip Quik Inc. |
2,340 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024 (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2055SOLDER SPHERES SAC305 .025 DIAM Chip Quik Inc. |
3,357 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025 (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
NC191LT500CSMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,509 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | - | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD291AX500T4CSOLDER PASTE 63/37 T4 500G Chip Quik Inc. |
3,770 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD4300AX500T4CSOLDER PASTE 63/37 T4 500G Chip Quik Inc. |
2,073 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMDLTLFP500T3SOLDER PASTE SN42/BI58 500G Chip Quik Inc. |
3,055 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD291SNL500T3CSOLDER PASTE NO-CLEAN SAC305 T3 Chip Quik Inc. |
2,106 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD4300SNL500T3CSOLDER PASTE SAC305 T3 500G Chip Quik Inc. |
3,369 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
NC191AX500T5CSMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
2,528 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD291SNL500T4CSOLDER PASTE SAC305 T4 500G Chip Quik Inc. |
2,532 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD4300SNL500T4CSOLDER PASTE SAC305 T4 500G Chip Quik Inc. |
3,077 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD291AX500T5SOLDER PASTE SN63/PB37 500G T5 Chip Quik Inc. |
3,712 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMDAL400CALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
3,196 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Cartridge, 14.11 oz (400g) | 12 Months | Date of Manufacture |
|
SMD291SNL500T5SOLDER PASTE SAC305 500G T5 Chip Quik Inc. |
2,843 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMDLTLFP500T4CSOLDER PASTE LOW TEMP T4 500G Chip Quik Inc. |
2,626 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD291AX500T5CSOLDER PASTE 63/37 T5 500G Chip Quik Inc. |
3,133 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD4300AX500T5CSOLDER PASTE 63/37 T5 500G Chip Quik Inc. |
3,859 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 5 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMDLTLFP500T5CSOLDER PASTE LOW TEMP T5 500G Chip Quik Inc. |
3,895 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
SMD291SNL500T5CSOLDER PASTE SAC305 T5 500G Chip Quik Inc. |
3,897 | - |
RFQ |
Ficha técnica |
Cartridge | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
