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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDLTLFP50T3SLDR PASTE NO-CLN SN42/BI58 50G Chip Quik Inc. |
2,060 | - |
RFQ |
Ficha técnica |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SMDLTLFP10SOLDER PASTE LOW TEMP 10CC W/TIP Chip Quik Inc. |
2,167 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMDLTLFPT5SOLDER PASTE NO CLEAN SN42/BI57. Chip Quik Inc. |
2,655 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
NC191LT35T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,775 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD291AX10T4SLDR PST NO-CLEAN 63/37 T4 10CC Chip Quik Inc. |
3,911 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
NC191AX50T5SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,227 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD291SNLT5SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
2,403 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMDAL50ALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
3,008 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMDAL10ALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
2,332 | - |
RFQ |
Ficha técnica |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Syringe, 0.88 oz (25g), 10cc | 12 Months | Date of Manufacture |
|
SMD2032-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,140 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016 (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMDLTLFP10T4SOLDER PASTE LOW TEMP T4 10CC Chip Quik Inc. |
2,453 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
NC191LT50T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,271 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SMD2024-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,992 | - |
RFQ |
Ficha técnica |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012 (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD291SNL10T4SLDR PST NO-CLEAN SAC305 T4 10CC Chip Quik Inc. |
3,151 | - |
RFQ |
Ficha técnica |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD3SW.020 4OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3,491 | - |
RFQ |
Ficha técnica |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
NC191SNL35T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
2,776 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
RASW.031 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
2,428 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC191AX250SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,813 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
RASWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,736 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC191SNL250SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
2,340 | - |
RFQ |
Ficha técnica |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
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