Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
6-1437535-3

6-1437535-3

CONN SOCKET SIP 8POS GOLD

TE Connectivity AMP Connectors
2,296 -

RFQ

6-1437535-3

Ficha técnica

Tube 500 Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Thermoplastic
818-AG12D

818-AG12D

CONN IC DIP SOCKET 18POS TINLEAD

TE Connectivity AMP Connectors
2,782 -

RFQ

818-AG12D

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
6-1437539-3

6-1437539-3

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors
3,022 -

RFQ

6-1437539-3

Ficha técnica

Tube 800 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
6-1437542-2

6-1437542-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
2,765 -

RFQ

6-1437542-2

Ficha técnica

- 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
643640-6

643640-6

CONN SOCKET SIP 8POS TIN

TE Connectivity AMP Connectors
2,758 -

RFQ

643640-6

Ficha técnica

Tray Diplomate DL Obsolete SIP 8 (1 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643642-2

643642-2

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors
3,495 -

RFQ

643642-2

Ficha técnica

Tray Diplomate DL Obsolete SIP 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
643644-8

643644-8

CONN SOCKET SIP 12POS TIN

TE Connectivity AMP Connectors
3,201 -

RFQ

643644-8

Ficha técnica

Tray Diplomate DL Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643645-6

643645-6

CONN SOCKET SIP 13POS TIN

TE Connectivity AMP Connectors
3,520 -

RFQ

643645-6

Ficha técnica

Tray Diplomate DL Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643647-6

643647-6

CONN SOCKET SIP 15POS TIN

TE Connectivity AMP Connectors
3,999 -

RFQ

643647-6

Ficha técnica

Tray Diplomate DL Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643647-8

643647-8

CONN SOCKET SIP 15POS TIN

TE Connectivity AMP Connectors
3,435 -

RFQ

643647-8

Ficha técnica

Tray Diplomate DL Obsolete SIP 15 (1 x 15) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643648-8

643648-8

CONN SOCKET SIP 16POS TIN

TE Connectivity AMP Connectors
3,176 -

RFQ

643648-8

Ficha técnica

Tray Diplomate DL Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643650-6

643650-6

CONN SOCKET SIP 18POS TIN

TE Connectivity AMP Connectors
3,575 -

RFQ

643650-6

Ficha técnica

Tray Diplomate DL Obsolete SIP 18 (1 x 18) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
643651-3

643651-3

CONN SOCKET SIP 19POS TIN

TE Connectivity AMP Connectors
2,346 -

RFQ

643651-3

Ficha técnica

Tray Diplomate DL Obsolete SIP 19 (1 x 19) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
643655-6

643655-6

CONN SOCKET SIP 23POS TIN

TE Connectivity AMP Connectors
3,005 -

RFQ

643655-6

Ficha técnica

Tray Diplomate DL Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
7-1437532-8

7-1437532-8

CONN IC DIP SOCKET 40POS

TE Connectivity AMP Connectors
3,986 -

RFQ

- 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) - - - Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) - - - -
799288-1

799288-1

CONN IC DIP SOCKET 16POS TINLEAD

TE Connectivity AMP Connectors
2,918 -

RFQ

799288-1

Ficha técnica

Box - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 3.00µin (0.076µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin-Lead 5.00µin (0.127µm) Brass Thermoplastic, Polyester, Glass Filled
8-1437532-2

8-1437532-2

CONN IC DIP SOCKET 40POS

TE Connectivity AMP Connectors
2,630 -

RFQ

8-1437532-2

Ficha técnica

- 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) - - - Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) - - - -
8-1437532-3

8-1437532-3

CONN IC DIP SOCKET 40POS TINLEAD

TE Connectivity AMP Connectors
2,398 -

RFQ

8-1437532-3

Ficha técnica

Bulk 500 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Beryllium Copper Polyester
540AG12DES

540AG12DES

CONN IC DIP SOCKET 40POS TINLEAD

TE Connectivity AMP Connectors
2,101 -

RFQ

540AG12DES

Ficha técnica

Bulk 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
824-AG12D

824-AG12D

CONN IC DIP SOCKET 24POS TINLEAD

TE Connectivity AMP Connectors
3,309 -

RFQ

824-AG12D

Ficha técnica

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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