Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
4-1437530-6

4-1437530-6

CONN SOCKET SIP 2POS GOLD

TE Connectivity AMP Connectors
3,009 -

RFQ

4-1437530-6

Ficha técnica

Tube 500 Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold - Beryllium Copper Thermoplastic
4-1437532-3

4-1437532-3

CONN IC DIP SOCKET 28POS

TE Connectivity AMP Connectors
3,225 -

RFQ

- 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) - - - Through Hole Closed Frame - 0.100 (2.54mm) - - - -
4-1437532-5

4-1437532-5

CONN IC DIP SOCKET 28POS

TE Connectivity AMP Connectors
3,098 -

RFQ

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) - - - Through Hole Closed Frame - 0.100 (2.54mm) - - - -
4-1437532-7

4-1437532-7

CONN IC DIP SOCKET 28POS

TE Connectivity AMP Connectors
3,814 -

RFQ

- 500 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) - - - Through Hole Closed Frame - 0.100 (2.54mm) - - - -
524-AG11D-ESL

524-AG11D-ESL

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,775 -

RFQ

524-AG11D-ESL

Ficha técnica

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
4-1437538-4

4-1437538-4

CONN IC DIP SOCKET 48POS TINLEAD

TE Connectivity AMP Connectors
3,432 -

RFQ

4-1437538-4

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
4-1437538-8

4-1437538-8

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors
3,838 -

RFQ

4-1437538-8

Ficha técnica

Tube,Tube 800 Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
4-1437539-6

4-1437539-6

CONN IC DIP SOCKET 18POS TINLEAD

TE Connectivity AMP Connectors
2,894 -

RFQ

4-1437539-6

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
4-1437539-8

4-1437539-8

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
2,954 -

RFQ

4-1437539-8

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
4-1437542-5

4-1437542-5

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,088 -

RFQ

4-1437542-5

Ficha técnica

- 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
4-382568-0

4-382568-0

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors
3,579 -

RFQ

4-382568-0

Ficha técnica

Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
5-1437504-2

5-1437504-2

CONN TRANSIST TO-3 3POS TIN-LEAD

TE Connectivity AMP Connectors
3,631 -

RFQ

5-1437504-2

Ficha técnica

Bulk 8060 Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead - Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead - Beryllium Copper Polytetrafluoroethylene (PTFE)
5-1437504-6

5-1437504-6

CONN TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,418 -

RFQ

Bulk 8060 Obsolete Transistor, TO-3 3 (Oval) - - - Beryllium Copper Chassis Mount Closed Frame Solder - - - Beryllium Copper Polytetrafluoroethylene (PTFE)
5-1437530-0

5-1437530-0

CONN SOCKET SIP 6POS

TE Connectivity AMP Connectors
2,198 -

RFQ

5-1437530-0

Ficha técnica

Bulk 500 Obsolete SIP 6 (1 x 6) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Beryllium Copper Thermoplastic
5-1437530-1

5-1437530-1

CONN SOCKET SIP 7POS

TE Connectivity AMP Connectors
2,733 -

RFQ

5-1437530-1

Ficha técnica

Tube 500 Obsolete SIP 7 (1 x 7) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Beryllium Copper Thermoplastic
820-AG10D-ES

820-AG10D-ES

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,074 -

RFQ

820-AG10D-ES

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
5-1437539-8

5-1437539-8

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors
3,170 -

RFQ

5-1437539-8

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
5-1437542-2

5-1437542-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,626 -

RFQ

5-1437542-2

Ficha técnica

- 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
5-1437542-8

5-1437542-8

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
3,622 -

RFQ

5-1437542-8

Ficha técnica

- 700 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
6-1437531-6

6-1437531-6

CONN IC DIP SOCKET 18POS

TE Connectivity AMP Connectors
2,233 -

RFQ

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) - - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) - - Copper Alloy -
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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