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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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5-1437504-7CONN TRANSIST TO-3 3POS GOLD TE Connectivity AMP Connectors |
3,640 | - |
RFQ |
Bulk | 8060 | Active | Transistor, TO-3 | 3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | |
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5-1437530-3CONN SOCKET SIP 9POS GOLD TE Connectivity AMP Connectors |
2,439 | - |
RFQ |
Ficha técnica |
Bulk | 500 | Obsolete | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
5-1437530-6CONN SOCKET SIP 12POS GOLD TE Connectivity AMP Connectors |
3,276 | - |
RFQ |
Ficha técnica |
Bulk | 500 | Obsolete | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
5-1437537-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,060 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
864-AG11D-ESLCONN IC DIP SOCKET 64POS GOLD TE Connectivity AMP Connectors |
3,476 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
643642-8CONN SOCKET SIP 10POS TIN TE Connectivity AMP Connectors |
2,197 | - |
RFQ |
Ficha técnica |
Tray,Box | Diplomate DL | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
643643-6CONN SOCKET SIP 11POS TIN TE Connectivity AMP Connectors |
2,556 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643655-8CONN SOCKET SIP 23POS TIN TE Connectivity AMP Connectors |
2,192 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
7-1437536-2CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors |
3,289 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
7-1437537-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,871 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
2-1437539-2CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
3,486 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
1-1825109-1CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
3,818 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
1-1825376-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
2,633 | - |
RFQ |
Ficha técnica |
Tube,Tray | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
1825094-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,710 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
1825108-1CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,650 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
1825109-3CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
2,120 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
1825276-2CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,652 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
1825376-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
2,901 | - |
RFQ |
Ficha técnica |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-821949-4CONN SOCKET PQFP 100POS TIN-LEAD TE Connectivity AMP Connectors |
2,548 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | QFP | 100 (4 x 25) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
1-1747890-1CONN SOCKET LGA 771POS GOLD TE Connectivity AMP Connectors |
3,291 | - |
RFQ |
Ficha técnica |
Tray | - | Obsolete | LGA | 771 (33 x 33) | 0.043 (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
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