Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1437537-4

1437537-4

808-11P1= INSUL.(RYNITE,BLK.)W

TE Connectivity AMP Connectors
3,264 -

RFQ

Bulk - Active - - - - - - - - - - - - - -
1640258-9

1640258-9

CONN SOCKET PGA 576POS GOLD

TE Connectivity AMP Connectors
3,692 -

RFQ

- - Obsolete PGA 576 (24 x 24) 0.039 (1.00mm) Gold - - Surface Mount Closed Frame Solder 0.039 (1.00mm) Gold - - Polyamide (PA), Nylon
5-1437504-0

5-1437504-0

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
2,066 -

RFQ

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP)
5-2013620-2

5-2013620-2

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors
3,251 -

RFQ

Bulk - Obsolete PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic
5-2013620-3

5-2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors
2,060 -

RFQ

Bulk - Obsolete PGA, ZIF (ZIP) 989 (35 x 36) 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) Tin-Lead 15.0µin (0.38µm) Copper Alloy Thermoplastic
5-6437504-5

5-6437504-5

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
2,545 -

RFQ

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Gold - Beryllium Copper Chassis Mount Closed Frame Solder - Gold - Beryllium Copper Phenolic
8-1437504-9

8-1437504-9

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
2,544 -

RFQ

8-1437504-9

Ficha técnica

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Copper 100.0µin (2.54µm) Beryllium Copper Phenolic
9-1437504-4

9-1437504-4

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,088 -

RFQ

9-1437504-4

Ficha técnica

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Silver 500.0µin (12.70µm) Beryllium Copper Chassis Mount Closed Frame Solder - - - Beryllium Copper Phenolic
9-1437504-5

9-1437504-5

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,806 -

RFQ

9-1437504-5

Ficha técnica

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Nickel 50.0µin (1.27µm) Beryllium Copper Phenolic
9-1437504-6

9-1437504-6

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,765 -

RFQ

9-1437504-6

Ficha técnica

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Nickel 50.0µin (1.27µm) Beryllium Copper Diallyl Phthalate (DAP)
9-1437504-8

9-1437504-8

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,408 -

RFQ

9-1437504-8

Ficha técnica

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Silver 50.0µin (1.27µm) Beryllium Copper Chassis Mount Closed Frame Solder - - - Beryllium Copper Diallyl Phthalate (DAP)
9-1437504-9

9-1437504-9

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors
3,745 -

RFQ

9-1437504-9

Ficha técnica

Bulk - Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Nickel 50.0µin (1.27µm) Beryllium Copper Diallyl Phthalate (DAP)
9-1437508-5

9-1437508-5

CONN SOCKET TRANSIST TO-5 4POS

TE Connectivity AMP Connectors
2,503 -

RFQ

Bulk - Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Tin - Brass Polyamide (PA), Nylon, Glass Filled
816-AG11D-ES

816-AG11D-ES

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
2,170 -

RFQ

816-AG11D-ES

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
1554116-1

1554116-1

CONN SOCKET LGA 1356LGA GOLD

TE Connectivity AMP Connectors
3,589 -

RFQ

Tray - Obsolete - - - - - - - - - - - - - -
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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