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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
2-1437539-0 CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors	2,650	-	RFQ	Ficha técnica	Tube	800	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
2-1437540-2 CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors	2,615	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	5.00µin (0.127µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
2-1437542-9 CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	3,122	-	RFQ	Ficha técnica	-	700	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Carrier, Closed Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy
816-AG11D-ESL-LF CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	3,766	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-210735-5 CONN SOCKET SIP 25POS TIN-LEAD TE Connectivity AMP Connectors	3,464	-	RFQ		Bulk	-	Obsolete	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin-Lead	-	-	Thermoplastic
2-382467-1 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	2,023	-	RFQ	Ficha técnica	Tube	Diplomate DL	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
2-641610-2 CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	3,723	-	RFQ	Ficha técnica	Tube	Diplomate DL	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	-
210748-5 CONN SOCKET PGA 6POS TIN-LEAD TE Connectivity AMP Connectors	2,547	-	RFQ	Ficha técnica	Tube	-	Obsolete	PGA	6 (2 x 3)	0.100 (2.54mm)	Tin-Lead	196.9µin (5.00µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass	Thermoplastic, Polyester, Glass Filled
3-1437504-6 CONN TRANSIST TO-3 3POS GOLD TE Connectivity AMP Connectors	3,563	-	RFQ	Ficha técnica	Bulk	8060	Obsolete	Transistor, TO-3	3 (Oval)	-	Gold	50.0µin (1.27µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Gold	50.0µin (1.27µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)
3-1437508-9 CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors	2,177	-	RFQ		Bulk	8058	Obsolete	Transistor, TO-5	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)
3-1437530-2 CONN SOCKET SIP 15POS TE Connectivity AMP Connectors	2,194	-	RFQ	Ficha técnica	Bulk	500	Obsolete	SIP	15 (1 x 15)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	-	-	Beryllium Copper	Thermoplastic
3-1437531-7 CONN IC DIP SOCKET 14POS TE Connectivity AMP Connectors	2,441	-	RFQ	Ficha técnica	Tube	500	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	-	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Copper Alloy	-
3-1437532-4 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	3,624	-	RFQ	Ficha técnica	-	500	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	-	-	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	-	-	-
3-1437537-0 CONN IC DIP SOCKET 14POS TINLEAD TE Connectivity AMP Connectors	2,794	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
3-1437537-5 CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors	3,099	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
832-AG11D-ESL-LF CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors	3,115	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
347846-3 CONN IC DIP SOCKET 28POS TINLEAD TE Connectivity AMP Connectors	2,276	-	RFQ		-	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin-Lead	-	-	Through Hole, Right Angle, Horizontal	Open Frame	-	-	-	-	-	-
390263-7 CONN IC DIP SOCKET 24POS TINLEAD TE Connectivity AMP Connectors	2,034	-	RFQ	Ficha técnica	Box	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Phosphor Bronze	-
4-1437504-5 CONN TRANSIST TO-3 3POS GOLD TE Connectivity AMP Connectors	3,342	-	RFQ	Ficha técnica	Bulk	8060	Obsolete	Transistor, TO-3	3 (Oval)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)
8080-1G39 CONN TRANSIST TO-3 3POS GOLD TE Connectivity AMP Connectors	2,607	-	RFQ	Ficha técnica	Bulk	8060	Obsolete	Transistor, TO-3	3 (Oval)	-	Gold	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)