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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3-1437536-4CONN IC DIP SOCKET 22POS GOLD TE Connectivity AMP Connectors |
2,050 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
3-1437538-2CONN IC DIP SOCKET 40POS TINLEAD TE Connectivity AMP Connectors |
2,152 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
382437-3CONN SOCKET SIP 3POS TIN TE Connectivity AMP Connectors |
2,613 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Obsolete | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
6-1437536-1CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors |
2,606 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
532-AG11D-ESLCONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
3,191 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester |
|
|
643653-3CONN SOCKET SIP 21POS TIN TE Connectivity AMP Connectors |
2,139 | - |
RFQ |
Ficha técnica |
Tray | Diplomate DL | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
7-1437532-1CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors |
3,119 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Polyester |
|
|
7-1437539-2CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors |
3,179 | - |
RFQ |
Ficha técnica |
Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
508-AG8DCONN IC DIP SOCKET 8POS TIN-LEAD TE Connectivity AMP Connectors |
2,538 | - |
RFQ |
Ficha técnica |
Tube | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | - |
|
1825375-3CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
3,154 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
1825375-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
2,156 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
1-1825093-6CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,319 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
1-1437504-0CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
2,126 | - |
RFQ |
Ficha técnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
1-1437504-1CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
2,673 | - |
RFQ |
Ficha técnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
1-1437508-3CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
2,986 | - |
RFQ |
Ficha técnica |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
|
1-1437532-5CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
2,910 | - |
RFQ |
Ficha técnica |
- | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | - | - | - |
|
508-AG10D-ESLCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
3,595 | - |
RFQ |
Ficha técnica |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Brass | - |
|
|
1-1437537-1CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
3,242 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic |
|
|
1-1437537-7CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
3,427 | - |
RFQ |
Ficha técnica |
- | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | - |
|
|
1-1437540-0CONN IC DIP SOCKET 36POS GOLD TE Connectivity AMP Connectors |
3,411 | - |
RFQ |
Ficha técnica |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
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