Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54121-410041700LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,971	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.125 (28.575mm)	0.336 (8.534mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-410062300RLF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,810	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.100 (2.540mm)	0.906 (23.000mm)	0.120 (3.050mm)	Through Hole	Kinked Pin, Solder	Tin	78.7µin (2.00µm)
54121-808051200LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	3,139	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.333 (8.450mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-106061000LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,907	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.230 (5.842mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-408081150LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,740	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.377 (9.576mm)	0.453 (11.500mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-409071800LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	2,981	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.196 (4.978mm)	0.709 (18.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-409081450LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,683	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.335 (8.500mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
10121021-801-02LF CONN HDR 2POS STACK T/H GOLD Amphenol ICC (FCI)	2,471	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	-	2	0.100 (2.54mm)	0.852 (21.641mm)	0.276 (7.000mm)	0.280 (7.100mm)	0.276 (7.000mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-810061400LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,308	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.479 (12.167mm)	0.551 (14.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
75970-108-03LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,125	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.652 (16.561mm)	0.217 (5.500mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-T32-03-063LF CONN HDR 6POS 0.079 STACK SMD Amphenol ICC (FCI)	3,588	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.488 (12.400mm)	0.240 (6.100mm)	0.248 (6.300mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54111-108041200LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,521	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.358 (9.100mm)	0.472 (12.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-418082100LF CONN HDR STACK Amphenol ICC (FCI)	2,842	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54121-407071050LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	3,645	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.292 (7.417mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59202-F26-06-055LF CONN HDR 12P 0.079 STACK SMD Amphenol ICC (FCI)	3,700	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	12	0.079 (2.00mm)	2	0.079 (2.00mm)	0.335 (8.500mm)	0.118 (3.000mm)	0.217 (5.500mm)	-	Surface Mount	Solder	Gold	8.00µin (0.203µm)
54122-411062300RLF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,717	-	RFQ		Bulk,Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.200 (5.080mm)	0.906 (23.000mm)	0.120 (3.050mm)	Through Hole	Kinked Pin, Solder	Tin	78.7µin (2.00µm)
59202-T30-02A080LF CONN HDR 4POS 0.079 STACK SMD Amphenol ICC (FCI)	2,895	-	RFQ	Ficha técnica	Tape & Reel (TR)	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.469 (11.900mm)	0.154 (3.900mm)	0.315 (8.000mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54122-110060950LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,332	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.631 (16.027mm)	0.374 (9.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-810061600LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,975	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.375 (9.525mm)	0.630 (16.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-808061500LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,876	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.925 (23.500mm)	0.240 (6.100mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)