Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
54121-506040650LF

54121-506040650LF

CONN HDR STACK

Amphenol ICC (FCI)
3,457 -

RFQ

Bag * Active - - - - - - - - - - - -
54121-506040640LF

54121-506040640LF

CONN HDR STACK

Amphenol ICC (FCI)
2,733 -

RFQ

Bag * Active - - - - - - - - - - - -
54111-101040850LF

54111-101040850LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,291 -

RFQ

54111-101040850LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 1 - 0.480 (12.200mm) 0.051 (1.295mm) 0.335 (8.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54111-105050900LF

54111-105050900LF

CONN HDR 5POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,256 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 5 0.100 (2.54mm) 1 - 0.695 (17.650mm) 0.246 (6.250mm) 0.354 (9.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
75970-3BB-04LF

75970-3BB-04LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,597 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 1 - 0.374 (9.500mm) 0.083 (2.100mm) 0.197 (5.000mm) 0.094 (2.400mm) Through Hole Solder Tin 78.7µin (2.00µm)
54122-429040500LF

54122-429040500LF

CONN HDR STACK

Amphenol ICC (FCI)
2,869 -

RFQ

Bulk * Active - - - - - - - - - - - -
54121-403060950LF

54121-403060950LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,553 -

RFQ

54121-403060950LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 0.626 (15.900mm) 0.132 (3.353mm) 0.374 (9.500mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54121-109021700LF

54121-109021700LF

CONN HDR STACK

Amphenol ICC (FCI)
3,134 -

RFQ

Bag * Active - - - - - - - - - - - -
75970-393-05LF

75970-393-05LF

CONN HDR 5POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,193 -

RFQ

75970-393-05LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 5 0.100 (2.54mm) 1 - 0.515 (13.081mm) 0.130 (3.300mm) 0.256 (6.500mm) 0.130 (3.300mm) Through Hole Solder Tin 78.7µin (2.00µm)
54111-110042050LF

54111-110042050LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,543 -

RFQ

54111-110042050LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 1 - 1.125 (28.575mm) 0.223 (5.664mm) 0.807 (20.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-106040950LF

54122-106040950LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,971 -

RFQ

54122-106040950LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.250 (6.350mm) 0.374 (9.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-106041100LF

54122-106041100LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,227 -

RFQ

54122-106041100LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.191 (4.851mm) 0.433 (11.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54111-407041550LF

54111-407041550LF

CONN HDR STACK

Amphenol ICC (FCI)
2,223 -

RFQ

Bag * Active - - - - - - - - - - - -
54112-118041500LF

54112-118041500LF

CONN HDR STACK

Amphenol ICC (FCI)
3,433 -

RFQ

Bag * Active - - - - - - - - - - - -
54121-402030800LF

54121-402030800LF

CONN HDR 3POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,412 -

RFQ

54121-402030800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 3 0.100 (2.54mm) 1 - 0.531 (13.500mm) 0.096 (2.450mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54121-403061000LF

54121-403061000LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,288 -

RFQ

54121-403061000LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 0.626 (15.900mm) 0.112 (2.845mm) 0.394 (10.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54121-407061300LF

54121-407061300LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,327 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 0.825 (20.955mm) 0.193 (4.902mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54111-802020850LF

54111-802020850LF

CONN HDR STACK

Amphenol ICC (FCI)
3,865 -

RFQ

Bag * Active - - - - - - - - - - - -
75970-8AP-02LF

75970-8AP-02LF

CONN HDR 2POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,014 -

RFQ

75970-8AP-02LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 2 0.100 (2.54mm) 1 - 1.750 (44.450mm) 0.135 (3.429mm) 1.480 (37.600mm) 0.135 (3.429mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54121-112041300LF

54121-112041300LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,372 -

RFQ

54121-112041300LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 1 - 1.325 (33.660mm) 0.693 (17.600mm) 0.512 (13.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
Total 1780 Record«Prev1234567...89Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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