Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
54121-107061000LF

54121-107061000LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,881 -

RFQ

54121-107061000LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 0.825 (20.955mm) 0.311 (7.900mm) 0.394 (10.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-107061200LF

54121-107061200LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,537 -

RFQ

54121-107061200LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 0.825 (20.955mm) 0.232 (5.900mm) 0.472 (12.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-F28-02A073LF

59202-F28-02A073LF

CONN HDR 4POS 0.079 STACK SMD

Amphenol ICC (FCI)
3,040 -

RFQ

59202-F28-02A073LF

Ficha técnica

Tape & Reel (TR) Minitek® 2.00mm Active 4 0.079 (2.00mm) 2 0.079 (2.00mm) 0.398 (10.100mm) 0.110 (2.800mm) 0.287 (7.300mm) - Surface Mount Solder Gold 8.00µin (0.203µm)
76745-3EM-12LF

76745-3EM-12LF

CONN HDR 12POS 0.100 STACK TH

Amphenol ICC (FCI)
2,591 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 12 0.100 (2.54mm) 2 0.100 (2.54mm) 0.965 (24.511mm) 0.354 (9.000mm) 0.366 (9.300mm) 0.245 (6.223mm) Through Hole Solder Tin 78.7µin (2.00µm)
75970-169-03LF

75970-169-03LF

CONN HDR 3POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,402 -

RFQ

75970-169-03LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 3 0.100 (2.54mm) 1 - 0.925 (23.500mm) 0.270 (6.858mm) 0.512 (13.000mm) 0.143 (3.632mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
861400101YD10712LF

861400101YD10712LF

CONN HDR 10POS 0.100 STACK TH

Amphenol ICC (FCI)
2,040 -

RFQ

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 1 - - 0.118 (3.000mm) - 0.118 (3.000mm) Through Hole Kinked Pin, Solder Gold Flash
54121-804050800LF

54121-804050800LF

CONN HDR 5POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,273 -

RFQ

54121-804050800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 5 0.100 (2.54mm) 1 - 0.660 (16.764mm) 0.225 (5.715mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-112042000LF

54122-112042000LF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,710 -

RFQ

54122-112042000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.418 (10.617mm) 0.787 (20.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
75970-3AT-06LF

75970-3AT-06LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,393 -

RFQ

75970-3AT-06LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 1.575 (40.000mm) 0.167 (4.242mm) 1.240 (31.500mm) 0.167 (4.242mm) Through Hole Solder Tin 78.7µin (2.00µm)
54121-409061800LF

54121-409061800LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,834 -

RFQ

54121-409061800LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 1.025 (26.035mm) 0.196 (4.978mm) 0.709 (18.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54111-104060900LF

54111-104060900LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,991 -

RFQ

54111-104060900LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 0.660 (16.764mm) 0.211 (5.359mm) 0.354 (9.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-111021200LF

54121-111021200LF

CONN HDR 2POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,298 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 2 0.100 (2.54mm) 1 - 1.225 (31.115mm) 0.633 (16.078mm) 0.472 (12.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
75970-7AY-04LF

75970-7AY-04LF

CONN HDR 4POS 0.100 STACK TH

Amphenol ICC (FCI)
3,003 -

RFQ

75970-7AY-04LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 1 - 0.913 (23.200mm) 0.339 (8.600mm) 0.236 (6.000mm) 0.339 (8.600mm) Through Hole Solder - -
54121-802050800LF

54121-802050800LF

CONN HDR 5POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,992 -

RFQ

54121-802050800LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 5 0.100 (2.54mm) 1 - 0.531 (13.500mm) 0.096 (2.450mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-106040950RLF

54122-106040950RLF

CONN HDR 4POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,779 -

RFQ

54122-106040950RLF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 4 0.100 (2.54mm) 2 0.100 (2.54mm) 0.744 (18.900mm) 0.250 (6.350mm) 0.374 (9.500mm) 0.120 (3.050mm) Through Hole Kinked Pin, Solder Gold, GXT™ 30.0µin (0.76µm)
54112-408061500LF

54112-408061500LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,040 -

RFQ

54112-408061500LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 2 0.100 (2.54mm) 0.925 (23.500mm) 0.239 (6.071mm) 0.591 (15.000mm) 0.095 (2.413mm) Through Hole Solder Tin 78.7µin (2.00µm)
54122-402100800LF

54122-402100800LF

CONN HDR 10POS 0.100 STACK TH

Amphenol ICC (FCI)
3,207 -

RFQ

54122-402100800LF

Ficha técnica

Bulk,Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.531 (13.500mm) 0.096 (2.450mm) 0.315 (8.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54122-414081400LF

54122-414081400LF

CONN HDR 8POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,440 -

RFQ

54122-414081400LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 8 0.100 (2.54mm) 2 0.100 (2.54mm) 1.040 (26.416mm) 0.369 (9.373mm) 0.551 (14.000mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54122-406061050LF

54122-406061050LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,578 -

RFQ

54122-406061050LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 2 0.100 (2.54mm) 0.745 (18.923mm) 0.211 (5.359mm) 0.413 (10.500mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
59112-T38-02-130LF

59112-T38-02-130LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,572 -

RFQ

Bag * Active - - - - - - - - - - - -
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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