Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54121-804080800LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,823	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.225 (5.715mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-803080900LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,663	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.626 (15.900mm)	0.177 (4.500mm)	0.354 (9.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59202-F24-02A053LF CONN HDR 4POS 0.079 STACK SMD Amphenol ICC (FCI)	3,904	-	RFQ	Ficha técnica	Tape & Reel (TR)	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.311 (7.900mm)	0.102 (2.600mm)	0.209 (5.300mm)	-	Surface Mount	Solder	Gold	8.00µin (0.203µm)
54112-106081350LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,220	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.118 (3.000mm)	0.531 (13.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-T32-03A085LF CONN HDR 6POS 0.079 STACK SMD Amphenol ICC (FCI)	2,279	-	RFQ	Ficha técnica	Tape & Reel (TR)	Minitek® 2.00mm	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.488 (12.400mm)	0.154 (3.900mm)	0.335 (8.500mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54122-109080900LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,232	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.551 (14.000mm)	0.354 (9.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
75970-590R04LF CONN HDR 4POS 0.100 STACK T/H Amphenol ICC (FCI)	2,323	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.515 (13.081mm)	0.307 (7.800mm)	0.256 (6.500mm)	0.130 (3.300mm)	Through Hole	Solder	Gold	Flash
54111-101050850LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2,920	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.480 (12.200mm)	0.051 (1.295mm)	0.335 (8.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54112-811042400LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,748	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.225 (31.115mm)	0.185 (4.700mm)	0.945 (24.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-806080950LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,158	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.250 (6.350mm)	0.374 (9.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-806081150LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,544	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.171 (4.350mm)	0.453 (11.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-106081000LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,248	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.744 (18.900mm)	0.230 (5.842mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59132-T36-05-098LF CONN HDR 10POS 0.079 STACK TH Amphenol ICC (FCI)	2,605	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.673 (17.100mm)	0.169 (4.300mm)	0.386 (9.800mm)	0.118 (3.000mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
54121-404050700LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2,284	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.264 (6.700mm)	0.276 (7.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-412101850LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3,605	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.477 (12.116mm)	0.728 (18.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
59112-S32-02-080LF CONN HDR STACK Amphenol ICC (FCI)	3,173	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
59202-H28-04-066LF CONN HDR 8POS 0.079 STACK SMD Amphenol ICC (FCI)	3,048	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	8	0.079 (2.00mm)	2	0.079 (2.00mm)	0.398 (10.100mm)	0.138 (3.500mm)	0.260 (6.600mm)	-	Surface Mount	Solder	Gold	Flash
54112-807081400LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,468	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.179 (4.550mm)	0.551 (14.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-107080950LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,171	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.356 (9.050mm)	0.374 (9.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-107081200LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,453	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.232 (5.900mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)