Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54121-102070800LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	3,929	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-T40-03-110LF CONN HDR 6POS 0.079 STACK SMD Amphenol ICC (FCI)	2,665	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.764 (19.400mm)	0.331 (8.400mm)	0.433 (11.000mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
75970-7AY-06LF CONN HDR 6POS 0.100 STACK TH Amphenol ICC (FCI)	3,686	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	0.913 (23.200mm)	0.339 (8.600mm)	0.236 (6.000mm)	0.339 (8.600mm)	Through Hole	Solder	-	-
54122-112062500LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,489	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.221 (5.613mm)	0.984 (25.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59132-S28-05-065LF CONN HDR STACK Amphenol ICC (FCI)	2,062	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54776-113-06LF CONN HDR STACK Amphenol ICC (FCI)	3,844	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54111-113062450LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,643	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	1.339 (34.000mm)	0.279 (7.087mm)	0.965 (24.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-118041200LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,110	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.102 (28.000mm)	0.510 (12.950mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-407081300LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,476	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.193 (4.902mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-1AN-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3,105	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	1.750 (44.450mm)	0.472 (12.000mm)	1.041 (26.441mm)	0.236 (6.000mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59202-F24-05A055LF CONN HDR 10P 0.079 STACK SMD Amphenol ICC (FCI)	3,053	-	RFQ	Ficha técnica	Tape & Reel (TR)	Minitek® 2.00mm	Active	10	0.079 (2.00mm)	2	0.079 (2.00mm)	0.311 (7.900mm)	0.094 (2.400mm)	0.217 (5.500mm)	-	Surface Mount	Solder	Gold	8.00µin (0.203µm)
54121-408081650LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,949	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.156 (3.950mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-809041650LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,586	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.255 (6.477mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-407121550LF CONN HDR STACK Amphenol ICC (FCI)	3,081	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
10112620-106LF CONN HDR 6POS 0.100 STACK T/H Amphenol ICC (FCI)	3,649	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.854 (21.700mm)	0.256 (6.500mm)	0.465 (11.800mm)	0.134 (3.400mm)	Through Hole	Solder	Gold	Flash
54121-406051050LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	3,283	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.744 (18.900mm)	0.210 (5.334mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-1AV-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,664	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	1.969 (50.000mm)	0.689 (17.500mm)	1.043 (26.500mm)	0.236 (6.000mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-112052000LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2,838	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	1.325 (33.660mm)	0.418 (10.617mm)	0.787 (20.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54111-809071800LF CONN HDR 7POS 0.1 STACK T/H Amphenol ICC (FCI)	2,200	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	7	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.221 (5.613mm)	0.709 (18.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-402110800LF CONN HDR 11POS 0.100 STACK TH Amphenol ICC (FCI)	2,485	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	11	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)