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Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54122-807081300LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,750	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.193 (4.902mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-110082250LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,371	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.145 (3.683mm)	0.886 (22.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
10132990-001TRLF CONN HDR STACK Amphenol ICC (FCI)	2,808	-	RFQ		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
76745-321-10LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3,926	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.471 (11.963mm)	0.728 (18.500mm)	0.126 (3.200mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-412101050LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	3,205	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	2	0.100 (2.54mm)	1.325 (33.660mm)	0.792 (20.117mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-112-06LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,381	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	0.525 (13.335mm)	0.224 (5.700mm)	0.200 (5.080mm)	0.100 (2.540mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-110080850LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,555	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.670 (17.018mm)	0.335 (8.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-810081600LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,631	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.125 (28.575mm)	0.375 (9.525mm)	0.630 (16.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59202-M26-06A054LF CONN HDR STACK SMD Amphenol ICC (FCI)	2,490	-	RFQ		Tape & Reel (TR)	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
90599-050 CONN HDR 8POS 0.079 STACK T/H Amphenol ICC (FCI)	2,556	-	RFQ		Bag	Minitek® 2.00mm	Active	8	0.079 (2.00mm)	2	0.079 (2.00mm)	0.500 (12.700mm)	0.171 (4.350mm)	0.157 (4.000mm)	0.171 (4.350mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-402100800LF CONN HDR 10POS 0.100 STACK TH Amphenol ICC (FCI)	2,888	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	10	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-156-04LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,505	-	RFQ	Ficha técnica	Box,Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.260 (32.000mm)	0.394 (10.000mm)	0.748 (19.000mm)	0.118 (3.000mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59112-T38-02-135LF CONN HDR 4POS 0.079 STACK T/H Amphenol ICC (FCI)	3,860	-	RFQ	Ficha técnica	Bag	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.752 (19.100mm)	0.122 (3.100mm)	0.531 (13.500mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	30.0µin (0.76µm)
59202-F24-06A055LF CONN HDR 12P 0.079 STACK SMD Amphenol ICC (FCI)	3,786	-	RFQ	Ficha técnica	Tape & Reel (TR)	Minitek® 2.00mm	Active	12	0.079 (2.00mm)	2	0.079 (2.00mm)	0.311 (7.900mm)	0.094 (2.400mm)	0.217 (5.500mm)	-	Surface Mount	Solder	Gold	8.00µin (0.203µm)
54112-109081500LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	2,115	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.340 (8.636mm)	0.591 (15.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-410041950LF CONN HDR STACK Amphenol ICC (FCI)	2,211	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54122-114081450LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,738	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.040 (26.416mm)	0.349 (8.865mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
75970-8AP-04LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,882	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.750 (44.450mm)	0.135 (3.429mm)	1.480 (37.600mm)	0.135 (3.429mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-809081450LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,344	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.335 (8.500mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54112-109081850LF CONN HDR 8POS 0.1 STACK T/H Amphenol ICC (FCI)	3,125	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	8	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.202 (5.131mm)	0.728 (18.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)