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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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123-43-624-41-801000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
199 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8058-1G23CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
1,171 | - |
RFQ |
Ficha técnica |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
8060-1G3CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
995 | - |
RFQ |
Ficha técnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
8058-1G24CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
749 | - |
RFQ |
Ficha técnica |
Bulk | 8058 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | - | Solder Cup | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
2041549-1SOCKET ASSY, DMD 350, T/R, G/F TE Connectivity AMP Connectors |
658 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | DMD | Active | PGA, ZIF (ZIP) | 350 (35 x 36) | 0.050 (1.27mm) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | - | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | |
|
ICF-632-S-O-TRCONN IC DIP SOCKET 32POS TIN Samtec Inc. |
273 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
|
12-8473-310CCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
170 | - |
RFQ |
Ficha técnica |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
117-43-668-41-005000CONN IC DIP SOCKET 68POS GOLD Mill-Max Manufacturing Corp. |
198 | - |
RFQ |
Ficha técnica |
Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8060-1G12CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
1,104 | - |
RFQ |
Ficha técnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) |
|
8060-1G11CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
3,869 | - |
RFQ |
Ficha técnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
2350616-1DUAL LGA,250 POS, DMD SOCKET TE Connectivity AMP Connectors |
451 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 250 (16 x 25) | 0.039 (1.00mm) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | Solder | - | - | - | - | Thermoplastic |
|
299-43-632-10-002000CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp. |
351 | - |
RFQ |
Ficha técnica |
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8059-2G9CONN TRANSIST TO-5 10POS GOLD TE Connectivity AMP Connectors |
1,052 | - |
RFQ |
Ficha técnica |
Bulk | 8059 | Obsolete | Transistor, TO-5 | 10 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon, Glass Filled |
|
116-93-308-41-007000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
1,264 | - |
RFQ |
Ficha técnica |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-314-41-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
110 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-93-310-41-105000CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp. |
2,270 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
101-93-422-41-560000CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp. |
486 | - |
RFQ |
Ficha técnica |
Tube | 101 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
116-93-318-41-007000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
892 | - |
RFQ |
Ficha técnica |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
8060-1G5CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
184 | - |
RFQ |
Ficha técnica |
Bulk | 8060 | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
123-93-320-41-801000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
150 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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