Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-43-422-41-001000

123-43-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
169 -

RFQ

123-43-422-41-001000

Ficha técnica

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8058-1G49

8058-1G49

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors
130 -

RFQ

8058-1G49

Ficha técnica

Bulk 8058 Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
299-93-306-10-001000

299-93-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
547 -

RFQ

299-93-306-10-001000

Ficha técnica

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-318-41-801000

123-43-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.
248 -

RFQ

123-43-318-41-801000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-424-41-001000

123-43-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
300 -

RFQ

123-43-424-41-001000

Ficha técnica

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-420-41-001000

612-11-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
226 -

RFQ

612-11-420-41-001000

Ficha técnica

Tube 612 Active DIP, 0.1 (2.54mm) Row Spacing - 0.039 (1.00mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.039 (1.00mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-640-41-001000

210-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
1,129 -

RFQ

210-13-640-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-324-11-001000

299-93-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
157 -

RFQ

299-93-324-11-001000

Ficha técnica

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-324-11-001000

299-43-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
112 -

RFQ

299-43-324-11-001000

Ficha técnica

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-622-10-002000

299-93-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.
195 -

RFQ

299-93-622-10-002000

Ficha técnica

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1051420132

1051420132

CONN SOCKET LGA 2011POS GOLD

Molex
211 -

RFQ

1051420132

Ficha técnica

Bulk 105142 Obsolete LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040 (1.01mm) - - - Thermoplastic
123-43-950-41-001000

123-43-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
179 -

RFQ

123-43-950-41-001000

Ficha técnica

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-43-640-41-801000

123-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
145 -

RFQ

123-43-640-41-801000

Ficha técnica

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2174988-2

2174988-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors
163 -

RFQ

2174988-2

Ficha técnica

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
299-93-636-10-002000

299-93-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
183 -

RFQ

299-93-636-10-002000

Ficha técnica

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
200-6313-9UN-1900

200-6313-9UN-1900

CONN SOCKET PGA ZIF 169POS GOLD

3M
119 -

RFQ

200-6313-9UN-1900

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
200-6315-9UN-1900

200-6315-9UN-1900

CONN SOCKET PGA ZIF 225POS GOLD

3M
3,413 -

RFQ

200-6315-9UN-1900

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) - - - - - - 0.100 (2.54mm) - - - Polyethersulfone (PES)
200-6319-9UN-1900

200-6319-9UN-1900

CONN SOCKET PGA ZIF 361POS GOLD

3M
125 -

RFQ

200-6319-9UN-1900

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 361 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
200-6321-9UN-1900

200-6321-9UN-1900

CONN SOCKET PGA ZIF 441POS GOLD

3M
3,519 -

RFQ

200-6321-9UN-1900

Ficha técnica

Bulk Textool™ Obsolete PGA, ZIF (ZIP) 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES)
105167-0001

105167-0001

6.50 BY 6.50MM CAMERA SOCKET, 4.

Molex
330,300 -

RFQ

105167-0001

Ficha técnica

Box * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 2425262728293031...1100Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario

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