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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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299-93-308-11-001000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
154 | - |
RFQ |
Ficha técnica |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
614-93-320-31-012000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
366 | - |
RFQ |
Ficha técnica |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
614-43-320-31-012000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
195 | - |
RFQ |
Ficha técnica |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
117-87-432-41-005101CONN IC DIP SOCKET 32POS GOLD Preci-Dip |
1,185 | - |
RFQ |
Ficha técnica |
Tube | 117 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-43-320-11-001000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
223 | - |
RFQ |
Ficha técnica |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
614-93-640-31-012000CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp. |
191 | - |
RFQ |
Ficha técnica |
Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-13-628-41-801000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
177 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
299-93-618-10-002000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
129 | - |
RFQ |
Ficha técnica |
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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|
346-43-164-41-013000CONN SOCKET SIP 64POS GOLD Mill-Max Manufacturing Corp. |
143 | - |
RFQ |
Ficha técnica |
Tube | 346 | Active | SIP | 64 (1 x 64) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
317-43-108-41-005000CONN SOCKET 8POS .070 STR GOLD Mill-Max Manufacturing Corp. |
106 | - |
RFQ |
Ficha técnica |
Tube | 317 | Active | SIP | 8 (1 x 8) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
3-1571550-0CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
704 | - |
RFQ |
Ficha técnica |
Tube | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
317-43-121-41-005000CONN SOCKET 21POS .070 STR GOLD Mill-Max Manufacturing Corp. |
351 | - |
RFQ |
Ficha técnica |
Tube | 317 | Active | SIP | 21 (1 x 21) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2319757-1DUAL LGA,257 POS, DMD SOCKET TE Connectivity AMP Connectors |
913 | - |
RFQ |
Ficha técnica |
Tray | DMD | Active | LGA | 257 (20 x 30) | 0.039 (1.00mm) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | Solder | - | - | - | - | Thermoplastic |
|
8080-1G1-LFCONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors |
379 | - |
RFQ |
Ficha técnica |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
1-2324271-6LEFT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors |
165 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-5RIGHT SEGMEN LGA4189-5 SOCKET-P5 TE Connectivity AMP Connectors |
163 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
2-2129710-7CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
154 | - |
RFQ |
Ficha técnica |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
110-44-306-41-001000CONN IC DIP SOCKET 6POS TIN Mill-Max Manufacturing Corp. |
4,218 | - |
RFQ |
Ficha técnica |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
D01-9970442CONN SOCKET SIP 4POS GOLD Harwin Inc. |
3,370 | - |
RFQ |
Ficha técnica |
Tube | D01-997 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9970542CONN SOCKET SIP 5POS GOLD Harwin Inc. |
2,498 | - |
RFQ |
Ficha técnica |
Tube | D01-997 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
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