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Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
211-1-06-003CONN IC DIP SOCKET 6POS GOLD CNC Tech |
8,006 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
211-1-08-003CONN IC DIP SOCKET 8POS GOLD CNC Tech |
5,796 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
DILB24P-224TLFCONN IC DIP SOCKET 24POS TINLEAD Amphenol ICC (FCI) |
10,853 | - |
RFQ |
Ficha técnica |
Tube | DILB | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
211-1-14-003CONN IC DIP SOCKET 14POS GOLD CNC Tech |
2,554 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
D01-9970742CONN SOCKET SIP 7POS GOLD Harwin Inc. |
4,797 | - |
RFQ |
Ficha técnica |
Tube | D01-997 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
D01-9971242CONN SOCKET SIP 12POS GOLD Harwin Inc. |
4,700 | - |
RFQ |
Ficha técnica |
Tube | D01-997 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
|
211-1-16-003CONN IC DIP SOCKET 16POS GOLD CNC Tech |
2,759 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
211-1-18-003CONN IC DIP SOCKET 18POS GOLD CNC Tech |
2,790 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
ICA-308-STTCONN IC DIP SOCKET 8POS TIN Samtec Inc. |
3,040 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
211-1-20-003CONN IC DIP SOCKET 20POS GOLD CNC Tech |
1,281 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
1050281001CONN CAM SOCKET 32POS GOLD Molex |
21,667 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | 105028 | Active | Camera Socket | 32 (4 x 8) | 0.035 (0.90mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Nickel | 50.0µin (1.27µm) | Copper Alloy | Thermoplastic |
|
211-1-24-006CONN IC DIP SOCKET 24POS GOLD CNC Tech |
1,307 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
211-1-28-006CONN IC DIP SOCKET 28POS GOLD CNC Tech |
1,315 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
NTE435K64SOCKET-64 PIN DIP .070 NTE Electronics, Inc |
296 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
ICA-318-STTCONN IC DIP SOCKET 18POS TIN Samtec Inc. |
1,054 | - |
RFQ |
Ficha técnica |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
NTE419SOCKET-3-PIN TO-5 NTE Electronics, Inc |
600 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-5 and TO-39 | 3 (Round) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - |
|
NTE209SOCKET TO-3 PWR NTE Electronics, Inc |
267 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Transistor, TO-3 | 2 (1 x 2) | - | - | - | - | Through Hole | - | - | - | - | - | - | - |
|
NTE435K52SOCKET-52 PIN DIP .070 NTE Electronics, Inc |
1,116 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.698 (17.72mm) Row Spacing | 52 (2 x 26) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - |
|
ICF-328-T-O-TR.100 SURFACE MOUNT SCREW MACHIN Samtec Inc. |
350 | - |
RFQ |
Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
|
NTE436W2828-PIN DIP IC SOCKET NTE Electronics, Inc |
296 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | - | - | - | - | Through Hole | - | Wire Wrap | - | - | - | - | - |
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