Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
211-1-06-003

211-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech
8,006 -

RFQ

211-1-06-003

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
211-1-08-003

211-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech
5,796 -

RFQ

211-1-08-003

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
DILB24P-224TLF

DILB24P-224TLF

CONN IC DIP SOCKET 24POS TINLEAD

Amphenol ICC (FCI)
10,853 -

RFQ

DILB24P-224TLF

Ficha técnica

Tube DILB Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon
211-1-14-003

211-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech
2,554 -

RFQ

211-1-14-003

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
D01-9970742

D01-9970742

CONN SOCKET SIP 7POS GOLD

Harwin Inc.
4,797 -

RFQ

D01-9970742

Ficha técnica

Tube D01-997 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9971242

D01-9971242

CONN SOCKET SIP 12POS GOLD

Harwin Inc.
4,700 -

RFQ

D01-9971242

Ficha técnica

Tube D01-997 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
211-1-16-003

211-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech
2,759 -

RFQ

211-1-16-003

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
211-1-18-003

211-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech
2,790 -

RFQ

211-1-18-003

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
ICA-308-STT

ICA-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.
3,040 -

RFQ

ICA-308-STT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
211-1-20-003

211-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech
1,281 -

RFQ

211-1-20-003

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
1050281001

1050281001

CONN CAM SOCKET 32POS GOLD

Molex
21,667 -

RFQ

1050281001

Ficha técnica

Tape & Reel (TR),Cut Tape (CT) 105028 Active Camera Socket 32 (4 x 8) 0.035 (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035 (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic
211-1-24-006

211-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech
1,307 -

RFQ

211-1-24-006

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
211-1-28-006

211-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech
1,315 -

RFQ

211-1-28-006

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
NTE435K64

NTE435K64

SOCKET-64 PIN DIP .070

NTE Electronics, Inc
296 -

RFQ

NTE435K64

Ficha técnica

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
ICA-318-STT

ICA-318-STT

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.
1,054 -

RFQ

ICA-318-STT

Ficha técnica

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
NTE419

NTE419

SOCKET-3-PIN TO-5

NTE Electronics, Inc
600 -

RFQ

NTE419

Ficha técnica

Bulk - Active Transistor, TO-5 and TO-39 3 (Round) - - - - Through Hole - Solder - - - - -
NTE209

NTE209

SOCKET TO-3 PWR

NTE Electronics, Inc
267 -

RFQ

NTE209

Ficha técnica

Bulk - Active Transistor, TO-3 2 (1 x 2) - - - - Through Hole - - - - - - -
NTE435K52

NTE435K52

SOCKET-52 PIN DIP .070

NTE Electronics, Inc
1,116 -

RFQ

NTE435K52

Ficha técnica

Bulk - Active DIP, 0.698 (17.72mm) Row Spacing 52 (2 x 26) - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
ICF-328-T-O-TR

ICF-328-T-O-TR

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.
350 -

RFQ

Tape & Reel (TR),Cut Tape (CT) iCF Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
NTE436W28

NTE436W28

28-PIN DIP IC SOCKET

NTE Electronics, Inc
296 -

RFQ

NTE436W28

Ficha técnica

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) - - - - Through Hole - Wire Wrap - - - - -
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1500+ Promedio diario de RFQ
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1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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