Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
105190-0001

105190-0001

7.50 BY 7.50MM CAMERA SOCKET, 4.

Molex
13,200 -

RFQ

105190-0001

Ficha técnica

Box * Active - - - - - - - - - - - - - -
47337-0001

47337-0001

8.50 BY 8.50MM CAMERA SOCKET, 4.

Molex
17,547 -

RFQ

47337-0001

Ficha técnica

Box * Active - - - - - - - - - - - - - -
105199-0001

105199-0001

8.50 BY 9.50MM CAMERA SOCKET, 4.

Molex
2,100 -

RFQ

105199-0001

Ficha técnica

Box * Active - - - - - - - - - - - - - -
78499-0002

78499-0002

6.50 BY 6.50MM CAMERA SOCKET, 3.

Molex
1,200 -

RFQ

78499-0002

Ficha técnica

Box * Active - - - - - - - - - - - - - -
105200-0008

105200-0008

5.50 BY 5.50MM CAMERA SOCKET, 3.

Molex
1,800 -

RFQ

105200-0008

Ficha técnica

Box * Active - - - - - - - - - - - - - -
78725-0002

78725-0002

SMIA85 CAMERA SOCKET T/BRD 18PIN

Molex
1,400 -

RFQ

Bulk * Active - - - - - - - - - - - - - -
47593-9000

47593-9000

1.01MM PITCH LGA 1366 PROCESSOR

Molex
441 -

RFQ

47593-9000

Ficha técnica

Box * Active - - - - - - - - - - - - - -
47594-0002

47594-0002

1.01MM BY 1.01MM PITCH LGA 1366

Molex
2,586 -

RFQ

47594-0002

Ficha técnica

Box * Active - - - - - - - - - - - - - -
245-14-1-03

245-14-1-03

CONN IC DIP SOCKET 14POS TIN

CNC Tech
635 -

RFQ

245-14-1-03

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
243-18-1-03

243-18-1-03

CONN IC DIP SOCKET 18POS TIN

CNC Tech
702 -

RFQ

243-18-1-03

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
540-44-044-17-400000

540-44-044-17-400000

CONN SOCKET PLCC 44POS TIN

Mill-Max Manufacturing Corp.
865 -

RFQ

540-44-044-17-400000

Ficha técnica

Tube 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS)
1-1814655-5

1-1814655-5

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors
4,978 -

RFQ

1-1814655-5

Ficha técnica

Bulk - Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
264-1300-00-0602J

264-1300-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M
3,831 -

RFQ

264-1300-00-0602J

Ficha técnica

Tube Textool™ Active DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
245-18-1-03

245-18-1-03

CONN IC DIP SOCKET 18POS TIN

CNC Tech
416 -

RFQ

245-18-1-03

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
ICM-306-1-GT-HT

ICM-306-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 6P

Adam Tech
360 -

RFQ

ICM-306-1-GT-HT

Ficha técnica

Tube ICM Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS)
110-47-308-41-001000

110-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
521 -

RFQ

110-47-308-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
A 40-LC-TR

A 40-LC-TR

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components
422 -

RFQ

A 40-LC-TR

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
DILB18P-223TLF

DILB18P-223TLF

CONN IC DIP SOCKET 18POS TINLEAD

Amphenol ICC (FCI)
446 -

RFQ

DILB18P-223TLF

Ficha técnica

Tube DILB Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon
110-93-314-41-001000

110-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
2,980 -

RFQ

110-93-314-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-320-41-001000

110-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
1,807 -

RFQ

110-93-320-41-001000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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