Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-314-41-001101

115-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,095 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-012-05-001101

510-83-012-05-001101

CONN SOCKET PGA 12POS GOLD

Preci-Dip
3,643 -

RFQ

510-83-012-05-001101

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-104-41-005101

917-87-104-41-005101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip
3,933 -

RFQ

917-87-104-41-005101

Ficha técnica

Bulk 917 Active Transistor, TO-5 4 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-104-41-053101

917-87-104-41-053101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip
2,735 -

RFQ

917-87-104-41-053101

Ficha técnica

Bulk 917 Active Transistor, TO-5 4 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-012101

116-83-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,875 -

RFQ

116-83-306-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-103-41-005101

917-87-103-41-005101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip
2,219 -

RFQ

917-87-103-41-005101

Ficha técnica

Bulk 917 Active Transistor, TO-5 3 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-103-41-053101

917-87-103-41-053101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip
3,589 -

RFQ

917-87-103-41-053101

Ficha técnica

Bulk 917 Active Transistor, TO-5 3 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-306-31-012101

614-87-306-31-012101

CONN IC DIP SOCKET 325POS GOLD

Preci-Dip
3,674 -

RFQ

614-87-306-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 325 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-210-41-001101

115-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,507 -

RFQ

Bulk 115 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-310-41-001101

115-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,512 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-001101

116-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,039 -

RFQ

116-87-304-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-003101

116-87-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,657 -

RFQ

116-87-306-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-306-41-003101

115-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,171 -

RFQ

115-83-306-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-304-41-001101

122-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,883 -

RFQ

122-83-304-41-001101

Ficha técnica

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-304-41-001101

123-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,902 -

RFQ

123-83-304-41-001101

Ficha técnica

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-610-41-001101

110-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,861 -

RFQ

110-87-610-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-610-41-001101

115-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,408 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-007101

116-83-304-41-007101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,998 -

RFQ

116-83-304-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-304-41-035101

146-83-304-41-035101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,382 -

RFQ

146-83-304-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-304-41-036101

146-83-304-41-036101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,619 -

RFQ

146-83-304-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev123456789...142Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuario