Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-432-41-005101

117-87-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
1,185 -

RFQ

117-87-432-41-005101

Ficha técnica

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-310-41-134191

114-87-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
1,998 -

RFQ

Tape & Reel (TR),Cut Tape (CT) 114 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-001101

110-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
266 -

RFQ

110-87-314-41-001101

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-001101

110-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
116 -

RFQ

110-87-316-41-001101

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-316-41-001101

123-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,086 -

RFQ

123-87-316-41-001101

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-640-41-001151

110-87-640-41-001151

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
141 -

RFQ

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-006101

116-87-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
319 -

RFQ

116-87-210-41-006101

Ficha técnica

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-628-41-117101

114-87-628-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,886 -

RFQ

114-87-628-41-117101

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-105101

110-87-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
460 -

RFQ

110-87-628-41-105101

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-642-41-005101

117-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,046 -

RFQ

117-87-642-41-005101

Ficha técnica

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-105101

110-87-632-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
216 -

RFQ

110-87-632-41-105101

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-008101

116-87-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
989 -

RFQ

116-87-320-41-008101

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-628-31-012101

614-87-628-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,220 -

RFQ

614-87-628-31-012101

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-316-41-134161

114-87-316-41-134161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,378 -

RFQ

114-87-316-41-134161

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-314-41-003101

115-87-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,619 -

RFQ

115-87-314-41-003101

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-008101

116-87-610-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,262 -

RFQ

116-87-610-41-008101

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-632-41-003101

115-87-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,625 -

RFQ

115-87-632-41-003101

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-304-41-005101

110-87-304-41-005101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,159 -

RFQ

110-87-304-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-304-41-001101

115-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,557 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-304-41-117101

114-87-304-41-117101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,796 -

RFQ

114-87-304-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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