Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-87-306-41-035101

146-87-306-41-035101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,503 -

RFQ

146-87-306-41-035101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-306-41-036101

146-87-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,571 -

RFQ

146-87-306-41-036101

Ficha técnica

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-018101

116-83-306-41-018101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,347 -

RFQ

116-83-306-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-001101

116-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,024 -

RFQ

116-83-304-41-001101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-308-31-012101

614-87-308-31-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,318 -

RFQ

614-87-308-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-308-41-134191

114-87-308-41-134191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,354 -

RFQ

Tape & Reel (TR),Cut Tape (CT) 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-210-01-742101

110-87-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,708 -

RFQ

110-87-210-01-742101

Ficha técnica

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-306-31-012101

614-83-306-31-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,438 -

RFQ

614-83-306-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-308-41-003101

115-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,069 -

RFQ

115-83-308-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-002101

116-87-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,031 -

RFQ

116-87-306-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-003101

116-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,945 -

RFQ

116-83-306-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-004101

116-87-304-41-004101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,340 -

RFQ

116-87-304-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-41-001101

110-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,793 -

RFQ

110-83-210-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-312-41-117101

114-87-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,947 -

RFQ

114-87-312-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-312-41-134161

114-87-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,354 -

RFQ

114-87-312-41-134161

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-008101

116-87-306-41-008101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,931 -

RFQ

116-87-306-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-001151

110-87-318-41-001151

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,594 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-210-41-105101

110-87-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,102 -

RFQ

110-87-210-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-10-001101

110-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,977 -

RFQ

110-87-314-10-001101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-003101

116-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,582 -

RFQ

116-87-308-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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