Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-83-306-41-001101

115-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,975 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-012-05-001101

510-87-012-05-001101

CONN SOCKET PGA 12POS GOLD

Preci-Dip
3,120 -

RFQ

510-87-012-05-001101

Ficha técnica

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-210-41-005101

110-87-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,672 -

RFQ

110-87-210-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-008101

116-87-304-41-008101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,999 -

RFQ

116-87-304-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-105161

110-87-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,980 -

RFQ

110-87-306-41-105161

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-006101

116-87-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,905 -

RFQ

116-87-306-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-306-41-117101

114-83-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,827 -

RFQ

114-83-306-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-306-41-134161

114-83-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,263 -

RFQ

114-83-306-41-134161

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-308-41-003101

115-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,834 -

RFQ

115-87-308-41-003101

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-005101

110-87-310-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,381 -

RFQ

110-87-310-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-610-41-005101

110-87-610-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,402 -

RFQ

110-87-610-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-41-001101

110-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,868 -

RFQ

110-87-312-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-012101

116-83-304-41-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,132 -

RFQ

116-83-304-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-009101

116-87-304-41-009101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,059 -

RFQ

116-87-304-41-009101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-018101

116-87-306-41-018101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,899 -

RFQ

116-87-306-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-304-41-001101

121-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,315 -

RFQ

121-83-304-41-001101

Ficha técnica

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-308-41-001101

115-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,316 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-105161

110-83-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,031 -

RFQ

110-83-306-41-105161

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-018101

116-87-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,207 -

RFQ

116-87-308-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-007101

116-87-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,943 -

RFQ

116-87-306-41-007101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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