Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-304-41-001101

110-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,610 -

RFQ

110-83-304-41-001101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-304-41-105101

110-87-304-41-105101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,747 -

RFQ

110-87-304-41-105101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-304-41-001101

614-87-304-41-001101

CONN IC DIP SOCKET 321POS GOLD

Preci-Dip
3,905 -

RFQ

614-87-304-41-001101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 321 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-005101

110-87-306-41-005101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,286 -

RFQ

110-87-306-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-605101

110-87-306-41-605101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,714 -

RFQ

110-87-306-41-605101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-304-41-001101

612-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,712 -

RFQ

612-87-304-41-001101

Ficha técnica

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-006101

116-87-304-41-006101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,963 -

RFQ

116-87-304-41-006101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-304-41-005101

110-83-304-41-005101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,556 -

RFQ

110-83-304-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-304-41-001101

115-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,891 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-306-41-001101

115-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,788 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-018101

116-87-304-41-018101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,066 -

RFQ

116-87-304-41-018101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-304-41-117101

114-83-304-41-117101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,843 -

RFQ

114-83-304-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-304-31-012101

614-87-304-31-012101

CONN IC DIP SOCKET 320POS GOLD

Preci-Dip
2,992 -

RFQ

614-87-304-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 320 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-003101

116-87-304-41-003101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,585 -

RFQ

116-87-304-41-003101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-306-41-117101

114-87-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,041 -

RFQ

114-87-306-41-117101

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-306-41-134161

114-87-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,458 -

RFQ

114-87-306-41-134161

Ficha técnica

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-306-41-003101

115-87-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,167 -

RFQ

115-87-306-41-003101

Ficha técnica

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-308-41-605101

110-87-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,806 -

RFQ

110-87-308-41-605101

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-308-41-005101

110-87-308-41-005101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,645 -

RFQ

110-87-308-41-005101

Ficha técnica

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-012101

116-87-304-41-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,808 -

RFQ

116-87-304-41-012101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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