+86 075582561136
Subir BOM
Zócalos para circuitos integrados, transistores
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR24-HZL-TTCONN IC DIP SOCKET 24POS TIN Assmann WSW Components |
2,565 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR28-HZL-TTCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
2,426 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
A06-LCG-TCONN IC DIP SOCKET 6POS GOLD Assmann WSW Components |
2,785 | - |
RFQ |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | - | - | Polybutylene Terephthalate (PBT), Glass Filled | |
|
A08-LCGCONN IC DIP SOCKET 8POS GOLD Assmann WSW Components |
2,461 | - |
RFQ |
- | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - | |
|
|
A14-LCGCONN IC DIP SOCKET 14POS GOLD Assmann WSW Components |
3,953 | - |
RFQ |
Ficha técnica |
- | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - |
|
|
A16-LCGCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
2,379 | - |
RFQ |
- | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - | |
|
|
A18-LCGCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
2,037 | - |
RFQ |
Ficha técnica |
- | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - |
|
|
A20-LCGCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
3,046 | - |
RFQ |
- | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - | |
|
A22-LCGCONN IC DIP SOCKET 22POS GOLD Assmann WSW Components |
3,122 | - |
RFQ |
Ficha técnica |
- | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - |
|
A24-LCGCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
2,470 | - |
RFQ |
- | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - | |
|
|
A28-LCGCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
2,986 | - |
RFQ |
- | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - | |
|
A40-LCGCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
3,519 | - |
RFQ |
- | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | - | - | - | |
|
AR22-HZW/TCONN IC DIP SOCKET 22POS GOLD Assmann WSW Components |
2,638 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR24-HZW/TCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
2,632 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR28-HZW/TCONN IC DIP SOCKET 28POS GOLD Assmann WSW Components |
3,245 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR40-HZW/TCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
2,330 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR08-HZL-TTCONN IC DIP SOCKET 8POS TIN Assmann WSW Components |
3,915 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR14-HZL-TTCONN IC DIP SOCKET 14POS TIN Assmann WSW Components |
2,584 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR16-HZL-TTCONN IC DIP SOCKET 16POS TIN Assmann WSW Components |
3,176 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR18-HZL-TTCONN IC DIP SOCKET 18POS TIN Assmann WSW Components |
2,128 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
