Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR 10-HZW/TN

AR 10-HZW/TN

CONN IC DIP SOCKET 4POS TIN

Assmann WSW Components
3,310 -

RFQ

AR 10-HZW/TN

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
AR 20-HZL/07-TT

AR 20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components
2,295 -

RFQ

AR 20-HZL/07-TT

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 40-HZL/01-TT

AR 40-HZL/01-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components
3,778 -

RFQ

AR 40-HZL/01-TT

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 18-HZW/TN

AR 18-HZW/TN

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components
3,164 -

RFQ

AR 18-HZW/TN

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 24-HZL/07-TT

AR 24-HZL/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
3,339 -

RFQ

AR 24-HZL/07-TT

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
A-CCS 052-Z-SM

A-CCS 052-Z-SM

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components
2,917 -

RFQ

A-CCS 052-Z-SM

Ficha técnica

Tube - Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled
AR 48-HZL/01-TT

AR 48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components
2,416 -

RFQ

AR 48-HZL/01-TT

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
A-CCS 068-Z-SM

A-CCS 068-Z-SM

IC SOCKET PLCC 68POS TIN SMD

Assmann WSW Components
2,019 -

RFQ

A-CCS 068-Z-SM

Ficha técnica

Tube - Active PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled
AR 32-HZL/07-TT

AR 32-HZL/07-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components
2,793 -

RFQ

AR 32-HZL/07-TT

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 24-HZL/07/7-TT

AR 24-HZL/07/7-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
3,893 -

RFQ

AR 24-HZL/07/7-TT

Ficha técnica

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AW 127-32/Z-T

AW 127-32/Z-T

SOCKET 32 CONTACTS SINGLE ROW

Assmann WSW Components
3,160 -

RFQ

AW 127-32/Z-T

Ficha técnica

- - Active - - - - - - - - - - - - - -
AR 40-HZL/07-TT

AR 40-HZL/07-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components
3,262 -

RFQ

AR 40-HZL/07-TT

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 48-HZL/07-TT

AR 48-HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components
2,064 -

RFQ

AR 48-HZL/07-TT

Ficha técnica

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 64-HZL-TT

AR 64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components
3,297 -

RFQ

AR 64-HZL-TT

Ficha técnica

Tray - Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR08-HZW/T

AR08-HZW/T

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components
2,044 -

RFQ

AR08-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR16-HZW/T

AR16-HZW/T

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
3,633 -

RFQ

AR16-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR18-HZW/T

AR18-HZW/T

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components
2,034 -

RFQ

AR18-HZW/T

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR20-HZW/T

AR20-HZW/T

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components
3,272 -

RFQ

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR20-HZL-TT

AR20-HZL-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components
2,257 -

RFQ

AR20-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR22-HZL-TT

AR22-HZL-TT

CONN IC DIP SOCKET 22POS TIN

Assmann WSW Components
3,467 -

RFQ

AR22-HZL-TT

Ficha técnica

Bag - Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
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1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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