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| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 10-HZW/TNCONN IC DIP SOCKET 4POS TIN Assmann WSW Components |
3,310 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
AR 20-HZL/07-TTCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
2,295 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR 40-HZL/01-TTCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
3,778 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR 18-HZW/TNCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
3,164 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR 24-HZL/07-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
3,339 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
A-CCS 052-Z-SMCONN SOCKET PLCC 52POS TIN Assmann WSW Components |
2,917 | - |
RFQ |
Ficha técnica |
Tube | - | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
|
AR 48-HZL/01-TTCONN IC DIP SOCKET 48POS GOLD Assmann WSW Components |
2,416 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
A-CCS 068-Z-SMIC SOCKET PLCC 68POS TIN SMD Assmann WSW Components |
2,019 | - |
RFQ |
Ficha técnica |
Tube | - | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
|
AR 32-HZL/07-TTCONN IC DIP SOCKET 32POS GOLD Assmann WSW Components |
2,793 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR 24-HZL/07/7-TTCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
3,893 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AW 127-32/Z-TSOCKET 32 CONTACTS SINGLE ROW Assmann WSW Components |
3,160 | - |
RFQ |
Ficha técnica |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
AR 40-HZL/07-TTCONN IC DIP SOCKET 40POS GOLD Assmann WSW Components |
3,262 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR 48-HZL/07-TTCONN IC DIP SOCKET 48POS GOLD Assmann WSW Components |
2,064 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR 64-HZL-TTCONN IC DIP SOCKET 64POS TIN Assmann WSW Components |
3,297 | - |
RFQ |
Ficha técnica |
Tray | - | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR08-HZW/TCONN IC DIP SOCKET 8POS GOLD Assmann WSW Components |
2,044 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR16-HZW/TCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
3,633 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AR18-HZW/TCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
2,034 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR20-HZW/TCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
3,272 | - |
RFQ |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | |
|
AR20-HZL-TTCONN IC DIP SOCKET 20POS TIN Assmann WSW Components |
2,257 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AR22-HZL-TTCONN IC DIP SOCKET 22POS TIN Assmann WSW Components |
3,467 | - |
RFQ |
Ficha técnica |
Bag | - | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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