Zócalos para circuitos integrados, transistores

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR18-HZL/07-TT

AR18-HZL/07-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components
2,489 -

RFQ

AR18-HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR20-HZL/07-TT

AR20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components
2,870 -

RFQ

AR20-HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR24-HZL/07-TT

AR24-HZL/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
2,884 -

RFQ

AR24-HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR24-HZL/7/07-TT

AR24-HZL/7/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
3,811 -

RFQ

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR28-HZL/07-TT

AR28-HZL/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components
2,402 -

RFQ

AR28-HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR28-HZL/7/07-TT

AR28-HZL/7/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components
2,577 -

RFQ

AR28-HZL/7/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR32-HZL/07-TT

AR32-HZL/07-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components
3,678 -

RFQ

AR32-HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR40-HZL/07-TT

AR40-HZL/07-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components
2,659 -

RFQ

AR40-HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR 48 HZL/07-TT

AR 48 HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components
2,263 -

RFQ

AR 48 HZL/07-TT

Ficha técnica

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
A-CCS20-Z

A-CCS20-Z

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components
3,335 -

RFQ

A-CCS20-Z

Ficha técnica

Bag - Obsolete PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS28-Z

A-CCS28-Z

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components
3,888 -

RFQ

A-CCS28-Z

Ficha técnica

Bag - Obsolete PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS32-Z

A-CCS32-Z

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components
3,435 -

RFQ

A-CCS32-Z

Ficha técnica

Bag - Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS44-Z

A-CCS44-Z

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components
3,512 -

RFQ

A-CCS44-Z

Ficha técnica

Bag - Obsolete PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS52-Z

A-CCS52-Z

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components
3,254 -

RFQ

A-CCS52-Z

Ficha técnica

Bag - Obsolete PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS68-Z

A-CCS68-Z

CONN SOCKET PLCC 68POS TIN

Assmann WSW Components
3,733 -

RFQ

A-CCS68-Z

Ficha técnica

Bag - Obsolete PLCC 68 (4 x 17) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS84-Z

A-CCS84-Z

CONN SOCKET PLCC 84POS TIN

Assmann WSW Components
2,903 -

RFQ

A-CCS84-Z

Ficha técnica

Bag - Obsolete PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS20-G

A-CCS20-G

CONN SOCKET PLCC 20POS GOLD

Assmann WSW Components
3,316 -

RFQ

A-CCS20-G

Ficha técnica

Tube - Obsolete PLCC 20 (4 x 5) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS32-G

A-CCS32-G

CONN SOCKET PLCC 32POS GOLD

Assmann WSW Components
3,871 -

RFQ

A-CCS32-G

Ficha técnica

Bag - Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS44-G

A-CCS44-G

CONN SOCKET PLCC 44POS GOLD

Assmann WSW Components
3,408 -

RFQ

A-CCS44-G

Ficha técnica

Bag - Obsolete PLCC 44 (4 x 11) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
A-CCS52-G

A-CCS52-G

CONN SOCKET PLCC 52POS GOLD

Assmann WSW Components
3,425 -

RFQ

A-CCS52-G

Ficha técnica

Bag - Obsolete PLCC 52 (4 x 13) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
Total 249 Record«Prev1... 678910111213Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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