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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
AW 127-26/Z-T SOCKET 26 CONTACTS SINGLE ROW Assmann WSW Components	2,258	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-27/Z-T SOCKET 27 CONTACTS SINGLE ROW Assmann WSW Components	3,119	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-28/Z-T SOCKET 28 CONTACTS SINGLE ROW Assmann WSW Components	2,992	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-29/Z-T SOCKET 29 CONTACTS SINGLE ROW Assmann WSW Components	3,995	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-10/Z-T SOCKET 10 CONTACTS SINGLE ROW Assmann WSW Components	2,484	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-30/Z-T SOCKET 30 CONTACTS SINGLE ROW Assmann WSW Components	2,377	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-31/Z-T SOCKET 31 CONTACTS SINGLE ROW Assmann WSW Components	3,189	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AR 18-HZL/01-TT CONN IC DIP SOCKET 18POS GOLD Assmann WSW Components	2,078	-	RFQ	Ficha técnica	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
AR 10-HZL/07-TT IC SOCKET 10 PIN MACH CONT Assmann WSW Components	3,819	-	RFQ	Ficha técnica	Tube	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-33/Z-T SOCKET 34 CONTACTS SINGLE ROW Assmann WSW Components	2,033	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AR 24-HZL/7-TT CONN IC DIP SOCKET 24POS TIN Assmann WSW Components	2,635	-	RFQ		Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
AW 127-20/Z-T SOCKET 20 CONTACTS SINGLE ROW Assmann WSW Components	2,177	-	RFQ	Ficha técnica	Bulk	-	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS)
AW 127-35/Z-T SOCKET 35 CONTACTS SINGLE ROW Assmann WSW Components	2,234	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-36/Z-T SOCKET 36 CONTACTS SINGLE ROW Assmann WSW Components	3,896	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-37/Z-T SOCKET 37 CONTACTS SINGLE ROW Assmann WSW Components	2,208	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-38/Z-T SOCKET 38 CONTACTS SINGLE ROW Assmann WSW Components	3,915	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-39/Z-T SOCKET 39 CONTACTS SINGLE ROW Assmann WSW Components	3,345	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AR 32-HZL-TT CONN IC DIP SOCKET 32POS TIN Assmann WSW Components	2,214	-	RFQ	Ficha técnica	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled
AW 127-40/Z-T SOCKET 40 CONTACTS SINGLE ROW Assmann WSW Components	2,712	-	RFQ	Ficha técnica	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AR 18-HZL/07-TT CONN IC DIP SOCKET 18POS GOLD Assmann WSW Components	2,753	-	RFQ	Ficha técnica	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester