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Zócalos para circuitos integrados, transistores

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
A-CCS68-G CONN SOCKET PLCC 68POS GOLD Assmann WSW Components	2,903	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	68 (4 x 17)	0.050 (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS20-Z-SM CONN SOCKET PLCC 20POS TIN Assmann WSW Components	2,240	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	20 (4 x 5)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS28-Z-SM CONN SOCKET PLCC 28POS TIN Assmann WSW Components	2,493	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	28 (4 x 7)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS32-Z-SM CONN SOCKET PLCC 32POS TIN Assmann WSW Components	3,741	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS44-Z-SM CONN SOCKET PLCC 44POS TIN Assmann WSW Components	3,230	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS52-Z-SM CONN SOCKET PLCC 52POS TIN Assmann WSW Components	2,923	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	52 (4 x 13)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS68-Z-SM CONN SOCKET PLCC 68POS TIN Assmann WSW Components	2,927	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	68 (4 x 17)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A-CCS84-Z-SM CONN SOCKET PLCC 84POS TIN Assmann WSW Components	3,867	-	RFQ	Ficha técnica	Bag	-	Obsolete	PLCC	84 (4 x 21)	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
A22-LCG-T-R CONN IC DIP SOCKET 22POS GOLD Assmann WSW Components	2,892	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A16-LC-TR CONN IC DIP SOCKET 16POS TIN Assmann WSW Components	3,861	-	RFQ		Bag	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
A22-LC-TR CONN IC DIP SOCKET 22POS TIN Assmann WSW Components	3,521	-	RFQ		Bag	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
A48-LC-TR CONN IC DIP SOCKET 48POS TIN Assmann WSW Components	2,019	-	RFQ		Bag	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
A08-LCG-T-R CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	3,462	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A14-LCG-T-R CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	2,473	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A16-LCG-T-R CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	3,979	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A18-LCG-T-R CONN IC DIP SOCKET 18POS GOLD Assmann WSW Components	2,473	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A20-LCG-T-R CONN IC DIP SOCKET 20POS GOLD Assmann WSW Components	2,431	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A24-LCG-T-R CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	2,735	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A28-LCG-T-R CONN IC DIP SOCKET 28POS GOLD Assmann WSW Components	2,381	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled
A40-LCG-T-R CONN IC DIP SOCKET 40POS GOLD Assmann WSW Components	3,702	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled