Más categorías de productos

Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Número de parte del fabricante	Disponibilidad	Precio	Cantidad	Ficha técnica	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
75970-394-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,624	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.564 (14.326mm)	0.130 (3.300mm)	0.304 (7.722mm)	0.130 (3.300mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-407021350LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3,033	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.177 (4.500mm)	0.531 (13.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-8AU-02LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3,291	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.313 (7.950mm)	0.200 (5.080mm)	0.313 (7.950mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-801020800LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	3,356	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.480 (12.200mm)	0.044 (1.118mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-107031050LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,906	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.292 (7.417mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
75970-330-03LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,464	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.760 (19.300mm)	0.110 (2.800mm)	0.539 (13.700mm)	0.110 (2.800mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54111-404031200LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3,603	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.093 (2.362mm)	0.472 (12.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54121-108021650LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,623	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.156 (3.950mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-112022500LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,304	-	RFQ	Ficha técnica	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	1.325 (33.660mm)	0.221 (5.613mm)	0.984 (25.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-407031300LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	3,651	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.825 (20.955mm)	0.193 (4.902mm)	0.512 (13.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
861400042YD10776LF CONN HDR 4POS 0.100 STACK TH Amphenol ICC (FCI)	2,808	-	RFQ		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	-	-	-	-	Through Hole	Kinked Pin, Solder	-	-
54111-105030900LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,184	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.695 (17.650mm)	0.246 (6.250mm)	0.354 (9.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-109021500LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,498	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.315 (8.000mm)	0.591 (15.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-403021000LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,193	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.626 (15.900mm)	0.112 (2.845mm)	0.394 (10.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54112-402040500LF CONN HDR STACK Amphenol ICC (FCI)	3,153	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
75970-305-04LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,184	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.025 (26.035mm)	0.460 (11.684mm)	0.445 (11.300mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54111-402040800LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,462	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.122 (3.100mm)	0.315 (8.000mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
75970-3BB-03LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,759	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.374 (9.500mm)	0.083 (2.100mm)	0.197 (5.000mm)	0.094 (2.400mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
10121021-401-02LF CONN HDR 2POS STACK T/H TIN Amphenol ICC (FCI)	2,410	-	RFQ	Ficha técnica	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	-	2	0.100 (2.54mm)	0.852 (21.641mm)	0.276 (7.000mm)	0.280 (7.100mm)	0.276 (7.000mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54111-415041150LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,771	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.652 (16.561mm)	0.104 (2.650mm)	0.453 (11.500mm)	0.095 (2.413mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)