Conectores rectangulares - Espaciadores de placa, Apiladores (placa a placa)

Foto: Número de parte del fabricante Disponibilidad Precio Cantidad Ficha técnica Packaging Series ProductStatus NumberofPositions Pitch NumberofRows RowSpacing Length-OverallPin Length-Post(Mating) Length-StackHeight Length-Tail MountingType Termination ContactFinish-Post(Mating) ContactFinishThickness-Post(Mating)
59202-S30-03-050LF

59202-S30-03-050LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,702 -

RFQ

Bag * Active - - - - - - - - - - - -
54122-807101350LF

54122-807101350LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,063 -

RFQ

54122-807101350LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.173 (4.400mm) 0.531 (13.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-807101050LF

54122-807101050LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,209 -

RFQ

54122-807101050LF

Ficha técnica

Bulk,Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.292 (7.417mm) 0.413 (10.500mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54112-807101050LF

54112-807101050LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,858 -

RFQ

54112-807101050LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 0.825 (20.955mm) 0.317 (8.052mm) 0.413 (10.500mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 15.0µin (0.38µm)
54122-112102250LF

54122-112102250LF

CONN HDR STACK

Amphenol ICC (FCI)
2,662 -

RFQ

Bag * Active - - - - - - - - - - - -
59132-F32-03-060

59132-F32-03-060

CONN HDR STACK

Amphenol ICC (FCI)
3,267 -

RFQ

Bag * Active - - - - - - - - - - - -
54121-416063050LF

54121-416063050LF

CONN HDR 6POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,245 -

RFQ

Bag BERGSTIK®, MezzSelect™, Basics+ Active 6 0.100 (2.54mm) 1 - 1.425 (36.200mm) 0.104 (2.650mm) 1.201 (30.500mm) 0.120 (3.050mm) Through Hole Solder Tin 78.7µin (2.00µm)
54112-109081700LF

54112-109081700LF

CONN HDR 8POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,421 -

RFQ

54112-109081700LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 8 0.100 (2.54mm) 2 0.100 (2.54mm) 1.025 (26.035mm) 0.261 (6.629mm) 0.669 (17.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-108081500LF

54121-108081500LF

CONN HDR 8POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,372 -

RFQ

54121-108081500LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 8 0.100 (2.54mm) 1 - 0.925 (23.500mm) 0.215 (5.450mm) 0.591 (15.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-503100635LF

54122-503100635LF

CONN HDR STACK

Amphenol ICC (FCI)
2,598 -

RFQ

Bag * Active - - - - - - - - - - - -
59202-H26-06A054LF

59202-H26-06A054LF

CONN HDR STACK SMD

Amphenol ICC (FCI)
3,871 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
54121-110091700LF

54121-110091700LF

CONN HDR 9POS 0.1 STACK T/H

Amphenol ICC (FCI)
3,563 -

RFQ

54121-110091700LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 9 0.100 (2.54mm) 1 - 1.125 (28.575mm) 0.335 (8.500mm) 0.669 (17.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54121-110092000LF

54121-110092000LF

CONN HDR 9POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,203 -

RFQ

54121-110092000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 9 0.100 (2.54mm) 1 - 1.125 (28.575mm) 0.218 (5.537mm) 0.787 (20.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59202-T22-02-044LF

59202-T22-02-044LF

CONN HDR 4POS 0.079 STACK SMD

Amphenol ICC (FCI)
2,822 -

RFQ

59202-T22-02-044LF

Ficha técnica

Bulk Minitek® 2.00mm Active 4 0.079 (2.00mm) 2 0.079 (2.00mm) 0.256 (6.500mm) 0.083 (2.100mm) 0.173 (4.400mm) - Surface Mount Solder Gold 30.0µin (0.76µm)
59202-S28-03A070LF

59202-S28-03A070LF

CONN HDR STACK

Amphenol ICC (FCI)
2,747 -

RFQ

Tape & Reel (TR) * Active - - - - - - - - - - - -
54112-110101500LF

54112-110101500LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,879 -

RFQ

54112-110101500LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.440 (11.176mm) 0.591 (15.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-110101500LF

54122-110101500LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
3,563 -

RFQ

54122-110101500LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.415 (10.550mm) 0.591 (15.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54122-112082000LF

54122-112082000LF

CONN HDR 8POS 0.1 STACK T/H

Amphenol ICC (FCI)
2,175 -

RFQ

54122-112082000LF

Ficha técnica

Bulk BERGSTIK®, MezzSelect™, Basics+ Active 8 0.100 (2.54mm) 2 0.100 (2.54mm) 1.325 (33.660mm) 0.418 (10.617mm) 0.787 (20.000mm) 0.120 (3.050mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
54112-110101700LF

54112-110101700LF

CONN HDR 10POS 0.100 STACK T/H

Amphenol ICC (FCI)
2,185 -

RFQ

54112-110101700LF

Ficha técnica

Bag BERGSTIK®, MezzSelect™, Basics+ Active 10 0.100 (2.54mm) 2 0.100 (2.54mm) 1.125 (28.575mm) 0.361 (9.169mm) 0.669 (17.000mm) 0.095 (2.413mm) Through Hole Solder Gold, GXT™ 30.0µin (0.76µm)
59112-T26-05-045LF

59112-T26-05-045LF

CONN HDR STACK

Amphenol ICC (FCI)
2,086 -

RFQ

Bag * Active - - - - - - - - - - - -
Total 1780 Record«Prev1... 1011121314151617...89Next»
1500+
1500+ Promedio diario de RFQ
20,000.000
20,000.000 Unidad estándar de producto
1800+
1800+ Fabricantes en todo el mundo
15,000+
15,000+ Almacén en inventario
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Inicio

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Producto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Teléfono

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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