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PMIC - Gestión de Energía - Especializada
| Foto: | Número de parte del fabricante | Disponibilidad | Precio | Cantidad | Ficha técnica | Packaging | Series | ProductStatus | Applications | Current-Supply | Voltage-Supply | OperatingTemperature | MountingType |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC35FS6512CAEFS6500 NXP USA Inc. |
3,804 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
MWCT1014SFVLHWCT1014SF 64 LQFP NXP USA Inc. |
2,791 | - |
RFQ |
Ficha técnica |
Bulk,Tray | - | Active | General Purpose | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount |
|
MC33FS8530A4ESSYSTEM BASIS CHIP FS8530 NXP USA Inc. |
3,198 | - |
RFQ |
Tray | * | Active | - | - | - | - | - | |
|
|
MC35FS4503CAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
2,577 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC35FS6503CAER2FS6500 NXP USA Inc. |
3,293 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
MWCT1023IFVLLKV4X WCT 100LQFP NXP USA Inc. |
2,735 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Microcontroller, MCU | - | 1.71V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount |
|
|
MWCT1123FVLLKV4X WCT 100LQFP NXP USA Inc. |
3,797 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Microcontroller, MCU | - | 1.71V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount |
|
|
MC35FS6503NAEFS6500 NXP USA Inc. |
2,777 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MWCT1014SFVLLWCT1014SF 100 LQFP NXP USA Inc. |
2,495 | - |
RFQ |
Ficha técnica |
Tray | - | Active | General Purpose | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount |
|
|
MWCT1014SFVLLRWCT1014SF 100 LQFP NXP USA Inc. |
2,144 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | Automotive, Wireless Power Transmitter | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount |
|
|
MC33FS6514LAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
3,237 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
MC33PF8100CFESIC POWER MANAGEMENT I.MX8QXP NXP USA Inc. |
3,752 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
MC33PF8100CHESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
3,049 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
3,988 | - |
RFQ |
Ficha técnica |
Tray | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
|
|
MC35FS6513CAER2SBC, DCDC 1.5A VCORE FS1B CAN,15 NXP USA Inc. |
2,791 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
|
MC33FS6523CAER2SYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
3,995 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | Surface Mount |
|
|
MC35FS6513NAEFS6500 NXP USA Inc. |
3,599 | - |
RFQ |
Ficha técnica |
Tray | Automotive, AEC-Q100 | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount |
|
MC34PF8100CCEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,011 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
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|
MVR5510AMMA0ESIC PMIC VR5510 QM NXP USA Inc. |
3,260 | - |
RFQ |
Tray | Automotive, AEC-Q100 | Active | Automotive | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | |
|
|
MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,266 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR) | - | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank |
- 1500+ Promedio diario de RFQ
- 20,000.000 Unidad estándar de producto
- 1800+ Fabricantes en todo el mundo
- 15,000+ Almacén en inventario
